MEMS Microphone Terminal Assembly with Embedded Pads
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Solution Overview
Problem
Existing MEMS microphone terminal assembly structures in mobile devices are thick due to the silicon microphone's thickness and lack waterproofing, leading to potential short-circuits from water ingress.
Innovation Solution
A terminal assembly structure for MEMS microphones featuring a signal let out board with an accommodation hole for a metal housing, a waterproof member between the MEMS chip and substrate, and pads on the same surface for direct soldering, ensuring thinness and waterproofing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a silicon microphone is directly adhered onto a signal let out board by solder paste, then the assembly process is simplified and mass production is facilitated, but the overall thickness of the terminal device increases
Solution Approach 1:
The patent embeds the soldering pad structure within the substrate itself, creating a nested configuration where the pad is integrated into the substrate thickness rather than adding external layers. This allows the microphone to be mounted in a recessed area, reducing the overall protruding thickness while maintaining the direct soldering assembly method
Solution Approach 2:
The patent transitions from a planar surface-mount approach to a three-dimensional embedded structure by creating recesses in the substrate. This dimensional change allows the microphone to be positioned within the substrate depth rather than adding to the external surface thickness, effectively reducing the overall device thickness while preserving ease of manufacture
2Device complexity
If a silicon microphone is used without additional waterproofing, then the device structure is simplified and production cost is reduced, but water ingress causes short-circuit and device failure
Solution Approach 1:
The substrate serves multiple functions simultaneously: it provides mechanical support, electrical connections through integrated pads, and waterproofing through its material properties and结构设计. This multi-functionality eliminates the need for separate waterproofing components, maintaining structural simplicity while ensuring reliability
Solution Approach 2:
The substrate acts as an intermediary barrier between the microphone and the external environment. By integrating waterproofing functionality into the substrate itself, it mediates between the need for simple structure and the requirement for water protection, preventing water ingress without adding complex external waterproofing layers
3Productivity
If the soldering pad is configured by screen printing on the substrate surface, then the manufacturing process is simplified and production efficiency is improved, but the pad structure adds to the overall thickness
Solution Approach 1:
The screen-printed soldering pad is configured within recesses of the substrate, creating a nested structure where the pad material is contained within the substrate depth. This maintains the simple screen-printing manufacturing process while preventing the pad from adding to the external thickness, as it is embedded within the existing substrate volume
Solution Approach 2:
The patent moves the soldering pad from a surface-level configuration to a subsurface embedded configuration. This dimensional transition allows the pad to be formed using screen printing within the substrate depth, maintaining production efficiency while eliminating thickness addition to the external device dimensions
Data Source
AI summary
The present disclosure provides a terminal assembly structure of a MEMS microphone, including a signal let out board disposed at a terminal and a silicon microphone disposed on the signal let out board. The silicon microphone includes a housing, a substrate forming an accommodation space with the housing, an MEMS chip and a waterproof member. The substrate is configured with a sound inlet connected to the outside. The waterproof member is sandwiched between the MEMS chip and the substrate. A position where the signal let out board corresponds to the silicon microphone is configured with an accommodation hole. The housing is accommodated in the accommodation hole. The substrate abuts a surface of the signal let out board and covers the accommodation hole. A surface of the substrate where the housing is assembled, is provided with at least one pad electrically connected with the signal let out board.