MEMS Microphone Module Trough-Shape Substrate Integration
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Solution Overview
Problem
Existing micro-electro-mechanical microphone modules face challenges in miniaturization and efficient sound signal transformation due to limitations in casing design and integration with electronic components, leading to suboptimal performance and protection against environmental factors.
Innovation Solution
The use of a substrate with a trough-shaped depression, made through molding techniques, which integrates a micro-electro-mechanical microphone and additional electronic components, along with structured metal layers and conductive paths, enables compact, airtight, and shielded modules with enhanced acoustic performance and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a traditional casing design with multiple components is used for mounting micro-electro-mechanical microphones, then the microphone can be mounted and protected, but the module size cannot be sufficiently minimized and integration with electronic components is inefficient
Solution Approach 1:
The patent combines the casing, mounting structure, and electronic component integration into a single substrate with a trough-shaped depression. The substrate serves multiple functions: it provides the casing structure, integrates the microphone, and incorporates conductive paths for electrical connections, thereby reducing the number of separate components and minimizing overall module size.
Solution Approach 2:
The substrate is designed as a multi-functional component that simultaneously acts as a casing, a mounting platform, and an electrical connection system. The trough-shaped depression provides both mechanical support and acoustic isolation, while integrated conductive paths enable electrical connections without requiring separate wiring, achieving multiple functions in a single structure.
2Productivity
If micro-electro-mechanical microphones are integrated with additional electronic components on the same substrate, then manufacturing efficiency and compactness are improved, but protection against mechanical and electromagnetic interference becomes more challenging
Solution Approach 1:
The patent places additional electronic components within the same substrate structure, nesting them alongside the micro-electro-mechanical microphone. This nested arrangement allows all components to be integrated into a compact module while the substrate provides a unified protective structure that shields components from external mechanical and electromagnetic interference.
Solution Approach 2:
The substrate is designed with localized features including the trough-shaped depression that provides acoustic isolation for the microphone, and integrated conductive paths that provide electromagnetic shielding for electronic components. Each region of the substrate is optimized to provide specific protection against different types of interference while maintaining overall compactness.
3Volume of moving object
If a trough-shaped depression substrate is used to integrate microphones and electronic components, then compact module design is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The substrate with the trough-shaped depression is manufactured as a pre-formed component using molding techniques before the micro-electro-mechanical microphone and additional electronic components are mounted onto it. This preliminary formation of the substrate structure allows for precise geometric features to be created in advance, ensuring proper acoustic isolation and electrical connection paths while simplifying the subsequent assembly process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient transformation of sound into electrical signals, provides protection against mechanical and electromagnetic interference, and achieves compact module designs with extended frequency bandwidth, while maintaining high manufacturing efficiency.
Implementation Method 1
micro-electro-mechanical microphone which dynamically transforms sound e.g., in the audible frequency range into electrical signals
Data Source
AI summary
A module including a micro-electro-mechanical microphone is disclosed. One embodiment provides a substrate having a trough-shaped depression and a micro-electro-mechanical microphone. The micro-electro-mechanical microphone is mounted into the trough-shaped depression of the substrate.