MEMS Micro-Pump Cooling for Low-Pressure Micro-Channel Flow
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Solution Overview
Problem
Existing MEMS cooling systems face challenges with high flow resistance in micro-channel structures, requiring high pump pressure and making the system prone to coolant line breakage and leakage, especially when cooling multiple IC components, which complicates coolant flow and temperature control.
Innovation Solution
A MEMS cooling device with micro-pump assemblies, including flexure valves and electrostatic comb drive structures, is positioned close to micro-channels to reduce system-wide pressure requirements, allowing only the micro-channels to withstand pumping pressure, thus maintaining low pressure in the rest of the cooling system and improving reliability and manufacturability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If MEMS micro-channels with small cross-sections are used for heat absorption, then thermal efficiency is improved due to large surface area, but high flow resistance is introduced requiring high pump pressure
Solution Approach 1:
The cooling system is divided into multiple independent micro-channel modules, each with its own integrated micro-pump assembly. This segmentation allows each module to operate at lower pressure independently, while collectively achieving the required heat dissipation through increased total surface area.
Solution Approach 2:
The micro-pump assembly is integrated directly within the micro-channel structure, with the pump positioned inside or adjacent to the channels it serves. This nesting eliminates the need for external high-pressure pumping systems and allows the pump to generate pressure only where needed, reducing overall system pressure requirements.
2Productivity
If high pump pressure is used to maintain coolant flow through micro-channels, then coolant circulation is improved, but the risk of coolant line breakage and leakage increases
Solution Approach 1:
The micro-pump assembly includes integrated check valves that automatically prevent backflow and maintain unidirectional coolant flow without requiring external control systems. This self-regulating mechanism prevents pressure surges and reduces the risk of line breakage by maintaining stable, controlled pressure levels.
Solution Approach 2:
The system uses variable voltage control of the micro-pump to dynamically adjust coolant flow rate and pressure based on actual heat dissipation needs. By matching pump output to demand, the system avoids unnecessary high-pressure operation that would increase leakage risk while maintaining adequate flow for thermal management.
3Temperature
If the number of cooled IC components is increased, then heat dissipation capacity is improved, but pumping pressure requirement changes making flow control more difficult
Solution Approach 1:
Each IC component or group of components has its own dedicated micro-pump assembly, allowing independent control of coolant flow to each thermal zone. This segmentation enables precise flow regulation tailored to the specific heat dissipation requirements of each component, simplifying overall system control.
Solution Approach 2:
The micro-pump assemblies use variable voltage control to dynamically adjust their operating characteristics based on real-time thermal conditions. This dynamic control allows the system to adapt flow rates and pressure levels as components are added or removed, maintaining optimal performance without complex manual recalibration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat transfer and circulation of coolant with reduced pressure requirements, enhancing the reliability and manufacturability of the cooling system while maintaining effective heat removal from ICs.
Implementation Method 1
electrostatic comb drive structure
Implementation Method 2
Heat generated by the operation of the IC is absorbed and transferred to the coolant
Implementation Method 3
The heated coolant is then circulated to an external heat exchanger in another part of the system where the heat is removed
Data Source
AI summary
A preferred embodiment of the MEMS cooling device of the invention comprises one or more MEMS micro-channel volumes in communication with one or more MEMS micro-pump assemblies wherein each micro-pump assembly comprises a flexure valve, such as a leaf valve and means to drive a coolant through the channel volumes such as an electrostatic interleaved comb drive structure. A preferred embodiment comprises an inlet micro-pump assembly and an outlet micro-pump assembly but the device may also be fabricated with a single pump mechanism per channel volume.