MEMS Mirror Sensor Layout for Stable 3D Scanning Accuracy
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Solution Overview
Problem
Existing three-dimensional measurement apparatuses using MEMS mirrors face instability due to environmental factors like temperature changes, causing unintended inclination and decreased measurement accuracy, as stress is induced when sensors are positioned near the MEMS substrate.
Innovation Solution
Incorporating an environment detection sensor positioned adjacent to the substrate fixing section but not overlapping with the MEMS substrate, allowing for detection of environmental factors without causing unstable swing motion, and using a cantilever support structure to correct thermal stress-induced warping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If an environment detection sensor is positioned near the MEMS substrate to detect temperature changes, then measurement accuracy can be maintained by compensating for environmental factors, but stress is induced on the MEMS substrate causing unstable swing motion of the mirror
Solution Approach 1:
A support structure is introduced as an intermediary element between the sensor and the MEMS substrate. The sensor is mounted on this support structure which extends from the substrate fixing section, positioning the sensor in a location that allows temperature detection without direct contact with or proximity to the MEMS substrate, thereby avoiding stress induction while maintaining the ability to compensate for environmental factors.
2Measurement precision
If the sensor is disposed to overlap with the MEMS substrate in plan view, then environmental factors can be detected more accurately, but stress is induced on the MEMS substrate and mirror swing motion becomes unstable
Solution Approach 1:
The sensor positioning problem is solved by transitioning from a two-dimensional planar arrangement to a three-dimensional spatial arrangement. The support structure extends in the vertical dimension (thickness direction of the substrate), allowing the sensor to be positioned at a height that prevents overlap with the MEMS substrate in plan view while still enabling accurate detection of environmental factors through its proximity to the substrate fixing section.
3Reliability
If the sensor is positioned adjacent to the substrate fixing section without overlapping the MEMS substrate, then stable swing motion is maintained, but the ability to detect environmental factors accurately is reduced
Solution Approach 1:
The system implements feedback control where the sensor continuously monitors environmental factors (temperature) and this information is fed back to a control section. The control section processes this feedback and adjusts the mirror's swing characteristics accordingly, allowing the system to maintain stable operation while compensating for environmental influences through active control rather than passive proximity-based detection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures precise positioning of the mirror's swing motion, maintaining high accuracy in three-dimensional measurements even with temperature changes, by adjusting the mirror's angle to compensate for environmental influences.
Implementation Method 1
a change in temperature or any other environmental factor changes the angle of swing motion of the mirror
Implementation Method 2
an environment detection sensor that detects an environment factor associated with the mirror
Data Source
AI summary
An optical scanning apparatus includes a MEMS substrate, a substrate fixing section to which the MEMS substrate is fixed, and an environment detection sensor that detects an environment factor associated with the mirror. The environment detection sensor is disposed in a position where the environment detection sensor overlaps with or is adjacent to the substrate fixing section but does not overlap with the MEMS substrate in a plan view viewed in a direction perpendicular to a surface of the MEMS substrate.