MEMS Module with Dual-Thickness Movable Portions for Pressure Accuracy
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Solution Overview
Problem
Existing MEMS pressure sensors face challenges in accurately detecting pressure across the entire pressure region due to variations in detection sensitivity based on the shape of the movable portion.
Innovation Solution
A MEMS module comprising multiple MEMS elements with different movable portion film thicknesses, each configured to detect air pressure in specific ranges, and an electronic component to calculate pressure changes using the warpage of these movable portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a single MEMS element with a specific movable portion shape is used, then the device complexity is reduced, but the measurement precision deteriorates because detection sensitivity varies across different pressure regions
Solution Approach 1:
The pressure detection range is segmented into multiple regions, with each MEMS element optimized for a specific pressure region. The first MEMS element detects lower pressure ranges while the second MEMS element detects higher pressure ranges, allowing accurate measurement across the entire pressure spectrum without requiring a single complex element design
Solution Approach 2:
Each MEMS element is given locally optimized properties through different movable portion film thicknesses. The first MEMS element has a thinner movable portion for high sensitivity in low pressure regions, while the second MEMS element has a thicker movable portion for stability in high pressure regions, enabling each element to excel in its designated pressure range
2Measurement precision
If the movable portion film thickness is reduced to increase detection sensitivity, then the measurement precision improves for low pressure regions, but the reliability deteriorates because the movable portion becomes too fragile for high pressure regions
Solution Approach 1:
The detection function is segmented across multiple MEMS elements with different structural parameters. The first MEMS element uses a thinner movable portion (first film thickness) optimized for sensitivity in low pressure regions, while the second MEMS element uses a thicker movable portion (second film thickness) optimized for durability in high pressure regions, eliminating the need to compromise between sensitivity and durability in a single element
Solution Approach 2:
The film thickness parameter of the movable portion is changed between different MEMS elements to match different operating conditions. By varying this critical parameter, each element achieves optimal performance for its intended pressure range, with thinner films providing higher sensitivity and thicker films providing greater mechanical strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the accuracy of pressure detection across varying pressure regions by utilizing multiple MEMS elements with distinct film thicknesses, allowing for precise air pressure measurement.
Implementation Method 1
a movable portion which is a portion of a substrate including a hollow portion formed therein, the movable portion configured to warp in shape according to an air pressure difference between an internal air pressure inside the hollow portion and an external air pressure outside the hollow portion
Implementation Method 2
an electronic component configured to calculate a change in external air pressure outside the substrate by using an amount of warpage of the movable portion
Data Source
AI summary
A MEMS module includes: a first MEMS element and a second MEMS element each including a movable portion which is a portion of a substrate including a hollow portion formed therein, the movable portion configured to warp in shape according to an air pressure difference between an internal air pressure inside the hollow portion and an external air pressure outside the hollow portion; and an electronic component configured to calculate a change in external air pressure outside the substrate by using an amount of warpage of the movable portion of at least one of the first MEMS element and the second MEMS element, wherein the amount of warpage of the movable portion according to the external air pressure differs between the first MEMS element and the second MEMS element.