MEMS Optical Image Stabilizer Integrating Sensor and Actuator
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Solution Overview
Problem
Conventional optical image stabilizing devices require a large area and increased height for assembly, and are prone to damage and deformation during the assembly process, compromising the sensitivity and quality of the image signal due to external forces and the use of flexible printed circuits or wire bonding.
Innovation Solution
An optical image stabilizing device is integrated onto a substrate using a semiconductor micro-electro-mechanical system (MEMS) process, comprising an outer frame module, an image sensor module, and an actuating module, where the image sensor module is suspended within a receiving space defined by the outer frame module and substrate, allowing for movement to offset external forces and maintain image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the image sensing component is assembled with outer package structure and FPC using conventional processes, then the device can be manufactured, but the platform area increases and assembly height increases
Solution Approach 1:
The patent integrates the image sensing component, outer package structure, and FPC into a single unified platform structure that is manufactured as one piece using semiconductor MEMS processes. This merging eliminates the need for separate assembly steps and reduces the total area required compared to conventional multi-component assemblies.
Solution Approach 2:
The unified platform structure performs multiple functions simultaneously: it serves as the mechanical support for the image sensing component, provides the outer package protection, and integrates the FPC for electrical connections. This multi-functionality reduces the number of separate components needed and minimizes the overall device footprint.
2Ease of manufacture
If the image sensing component is assembled with outer package structure and FPC using conventional processes, then the device can be manufactured, but the assembly height increases
Solution Approach 1:
By combining the image sensing component, outer package structure, and FPC into a single integrated platform manufactured via semiconductor MEMS processes, the patent eliminates the vertical stacking and separate assembly steps that increase height in conventional designs. The unified structure achieves compact height while maintaining manufacturability.
3Ease of manufacture
If external forces are applied during assembly of image sensing component and platform, then the assembly can be completed, but the platform suffers damage and deformation compromising sensitivity and image quality
Solution Approach 1:
The patent manufactures the image sensing component and platform as a single integrated structure using semiconductor MEMS processes, eliminating the assembly step that exposes the platform to damaging external forces. This integration ensures the platform maintains its sensitivity and structural integrity while still enabling functional assembly through wafer-level bonding techniques.
Solution Approach 2:
The platform and image sensing component are pre-integrated into a unified structure during the semiconductor manufacturing process before final device assembly. This preliminary integration protects the platform from subsequent handling and assembly forces that would cause damage in conventional separate-component assemblies.
4Ease of operation
If FPC extends outwardly from image sensing component, then electrical connections can be established, but the device area increases and assembly complexity increases
Solution Approach 1:
The FPC is integrated directly into the unified platform structure, eliminating the need for separate FPC extensions that increase device area. The electrical connections are established through the integrated platform architecture, maintaining connectivity while minimizing the overall footprint.
Data Source
AI summary
An optical image stabilizing device is to be formed on a substrate, and includes an outer frame, an image sensor module, and an actuating module. The outer frame module is disposed on the substrate. The outer frame module and the substrate cooperatively define a receiving space. The image sensor module is suspended in the receiving space. The actuating module connects the outer frame module and the image sensor module, and is configured to drive the image sensor module to move for adjusting a relative position of the image sensor module with respect to the outer frame module.