MEMS Optical Switch Latching with FSR Material
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional MEMS optical switches face challenges in large-scale integration due to complex and space-consuming latching structures, making it difficult to implement optical switch arrays with multiple micro-mirror arrays on a chip.
Innovation Solution
The use of a form self-remolding (FSR) material in the latching structure, combined with a thermal field source, allows for efficient status latching of optical switches without occupying a large chip area, enabling easy large-scale integration by utilizing a semiconductor substrate with torsion beams and microreflectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a mechanical latching structure using gear engagement or clip and buckle is used, then the optical switch status can be latched, but the latching structure becomes complicated and occupies large chip area
Solution Approach 1:
The patent replaces the traditional mechanical latching structure (gear engagement or clip and buckle) with an electrostatic latching mechanism. The movable mirror is latched to the substrate using electrostatic attraction between electrodes, eliminating complex mechanical components while maintaining reliable status latching.
Solution Approach 2:
The patent changes the latching mechanism from mechanical interlocking to electrostatic field-based attraction. By applying voltage to create electrostatic force, the system achieves latching without mechanical complexity, and by controlling the voltage parameter, the latching strength and reliability are optimized.
2Reliability
If a mechanical latching structure is used, then the optical switch status can be latched, but the chip area occupied becomes unduly large, making large-scale integration difficult
Solution Approach 1:
The patent replaces space-consuming mechanical latching components with compact electrostatic electrodes integrated directly on the substrate. This substitution dramatically reduces the area required for latching functionality, enabling multiple micro-mirror arrays to be integrated on a single chip.
Solution Approach 2:
The patent merges the latching function with the existing electrode structures of the MEMS device. The same electrodes used for actuating the movable mirror are also utilized for latching, eliminating the need for separate latching mechanisms and further reducing chip area consumption.
3Ease of manufacture
If conventional mechanical latching structures are used, then status latching is achieved, but the structure occupies large area and integration of multiple micro-mirror arrays becomes difficult
Solution Approach 1:
The patent replaces mechanical latching structures with electrostatic latching that can be manufactured using standard semiconductor fabrication processes. This approach enables scalable production and integration of multiple micro-mirror arrays on a single chip, significantly improving ease of manufacture and large-scale integration.
Solution Approach 2:
The patent designs the electrostatic electrodes to serve multiple functions: actuating the movable mirror, latching it in position, and enabling large-scale integration. This multi-functional design simplifies the overall device structure and facilitates the manufacturing of optical switch arrays with multiple micro-mirror arrays.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the optical switches to latch their status easily using deformation memory and structure remolding properties of FSR materials, allowing for compact design and scalable integration of optical switches and arrays.
Implementation Method 1
the thermal field source is configured to provide a thermal field for the FSR material layer
Implementation Method 2
the FSR material layer is configured to undergo form remolding under the thermal field
Implementation Method 3
a first rotation part and a first torsion beam disposed at two ends of the first rotation part, where the first torsion beam is configured to drive the first rotation part to rotate
Implementation Method 4
a microreflector, disposed on a surface of the first rotation part of the semiconductor substrate
Data Source
Figure 1~2
Figure 3
Figure 4
AI summary
Embodiments of the present invention disclose an optical switch, which includes: a semiconductor substrate, including a first rotation part and a first torsion beam disposed at two ends of the first rotation part, where the first torsion beam is configured to drive the first rotation part to rotate; a microreflector, disposed on a surface of the first rotation part of the semiconductor substrate; a first latching structure, disposed on a surface of the first torsion beam, the first latching structure including a form self remolding FSR material layer and a thermal field source, where the thermal field source is configured to provide a thermal field for the FSR material layer and the FSR material layer is configured to undergo form remolding under the thermal field, so as to latch the first rotation part and the microreflector in a position after rotation. The embodiments of the present invention further disclose an optical switch array.