MEMS Optical Beam Waveguides for Die Stack Alignment
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Solution Overview
Problem
Existing optical interconnects between integrated circuit chips face challenges due to alignment issues, cost, complexity, and bandwidth limitations, particularly in stacked die modules, where conductor-based connections restrict power and bandwidth, and external deflection structures increase system complexity and cost.
Innovation Solution
The implementation of MEMS optical beam waveguides with multiple deflection electrodes for two-dimensional alignment and controlled feedback, allowing for precise optical beam alignment and communication between die stacks without external deflection structures, thereby enhancing communication density and reducing power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conductor-based connections (TSVs) are used for data signal communication between stacked die modules, then electrical connectivity is achieved, but power consumption increases and bandwidth is limited
Solution Approach 1:
The patent replaces electrical conductor-based connections (TSVs) with optical waveguide connections for data signal transmission between stacked die modules. This substitution of electrical fields with optical fields enables higher bandwidth communication while reducing power consumption, as optical signals can carry more data simultaneously and experience less resistive heating.
Solution Approach 2:
The patent changes the fundamental transmission medium parameter from electrical conductors to optical waveguides. This parameter change enables the system to overcome the inherent bandwidth limitations and power consumption issues of electrical TSVs by utilizing optical signals that can transmit data at higher rates with lower energy loss.
2Adaptability or versatility
If external mirrors or deflectors are used to transfer optical information between IC chips, then alignment flexibility is improved, but system complexity and cost increase
Solution Approach 1:
The patent merges the optical waveguide structure directly with the IC chip substrate, integrating the optical transmission medium into the chip itself rather than using separate external mirrors or deflectors. This integration eliminates the need for additional alignment components while maintaining the ability to direct optical signals between chips through the waveguide paths embedded in the chip structure.
Solution Approach 2:
The patent introduces optical waveguides as intermediary structures that are fabricated as part of the IC chip. These waveguides serve as built-in optical channels that replace the need for external mirrors or deflectors, providing a direct and integrated path for optical signal transmission between chips without requiring complex external alignment mechanisms.
3Reliability
If tight alignment tolerances are used to meet information transmission requirements, then signal transmission quality is improved, but manufacturing cost increases
Solution Approach 1:
The patent performs preliminary alignment by fabricating the optical waveguides and their coupling structures directly into the IC chips during the manufacturing process. This preliminary integration ensures that the optical paths are pre-aligned at the fabrication stage, eliminating the need for costly post-assembly alignment adjustments and reducing manufacturing complexity while maintaining signal transmission quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high-density, low-power, high-performance information systems by providing precise optical alignment and communication between die stacks, improving bandwidth and reducing system complexity and cost, while maintaining alignment even under conditions like vibration or temperature changes.
Implementation Method 1
transfer modulated light signals along an optical fiber or waveguide path
Implementation Method 2
Multiple deflection electrodes are formed on and around the MEMS optical beam waveguide
Data Source
AI summary
A high density, low power, high performance information system, method and apparatus are described in which perpendicularly oriented processor and memory die stacks (130, 140, 150, 160, 170) include integrated deflectable MEMS optical beam waveguides (e.g., 190) at each die edge to provide optical communications (182-185) in and between die stacks by supplying deflection voltages to a plurality of deflection electrodes (195-197) positioned on and around each MEMS optical beam waveguide (193-194) to provide two-dimensional alignment and controlled feedback to adjust beam alignment and establish optical communication links between die stacks.