Oven-Controlled MEMS Oscillator High-Temperature Turnover

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Solution Overview

Problem

Existing oven-controlled MEMS oscillators suffer from lower frequency stability due to worse frequency-vs-temperature characteristics, requiring more accurate temperature control than quartz-based OCXOs to maintain stability over varying ambient temperatures.

Innovation Solution

Increasing the average doping concentration of silicon to 9*10^19 cm^-3 or more to achieve a high-temperature turnover point at 85° C or more, with a low curvature of the frequency-vs-temperature curve, allowing for minimal frequency changes with ovenization temperature, and utilizing a thermostatic controller to maintain this temperature.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the doping concentration of silicon resonator is increased to achieve a high-temperature turnover point, then frequency stability over broad temperature range is improved, but manufacturing precision requirements are worsened

Engineering Contradiction:
Improvefrequency stabilityVSAvoiddoping concentration control
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent changes the doping concentration parameter of silicon to achieve a high-temperature turnover point (85°C or more). By adjusting this physical parameter, the frequency-vs-temperature curve is modified to have minimal curvature at the turnover point, enabling stable frequency operation across broad temperature ranges without requiring complex temperature compensation circuitry.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The doping concentration is predetermined and optimized during the manufacturing process to create the desired high-temperature turnover point characteristics. This preliminary adjustment of the silicon material properties eliminates the need for complex post-manufacturing temperature compensation mechanisms, thereby reducing device complexity while maintaining frequency stability.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If a thermostatic controller is used to maintain high turnover temperature, then frequency stability is improved, but device complexity is worsened

Engineering Contradiction:
Improvefrequency stabilityVSAvoidcontrol circuitry
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The silicon resonator is designed to have an intrinsic high-temperature turnover point through optimized doping concentration. The resonator itself provides the temperature compensation effect through its physical properties, eliminating the need for external active temperature compensation circuitry. The thermostatic controller simply maintains the turnover temperature rather than requiring complex frequency-tracking and compensation mechanisms.

Inventive Principle:
Principle #25Self-service

3Reliability

If ovenization temperature is controlled accurately, then frequency stability is improved, but energy consumption is worsened

Engineering Contradiction:
Improvefrequency stabilityVSAvoidoven power consumption
Core Design Contradiction:
ReliabilityVSUse of energy by stationary object

Solution Approach 1:

By changing the turnover temperature parameter to a higher value (85°C or more), the patent enables more efficient oven operation. The high-temperature turnover point is achieved through material property optimization (doping concentration), allowing the oven to operate at a stable, elevated temperature with reduced power consumption compared to maintaining lower temperatures with complex compensation schemes.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach provides a stable frequency over a broad temperature range, reducing the complexity of circuitry and achieving frequency stability comparable to quartz-based OCXOs, with curvature of the frequency-vs-temperature curve brought to 20 ppb/C^2 or less, significantly improving ovenized resonator performance.

Implementation Method 1

a resonator element (11) comprising doped silicon and an actuator for exciting the resonator element into a resonance mode having a characteristic frequency-vs-temperature curve

Methodology Applied
Scientific EffectResonance: Resonance

Implementation Method 2

a thermostatic controller (13) for keeping the temperature of the resonator element at said high turnover temperature

Methodology Applied
Scientific EffectHeating: Heating

Data Source

PatentUS11190133B2Oven-controlled frequency reference oscillator and method of fabricating thereof
Publication Date: 2021.11.30 KYOCERA TECH OY
  • US11190133B2 patent drawing
  • US11190133B2 patent drawing

AI summary

A temperature-compensated microelectromechanical oscillator and a method of fabricating thereof. The oscillator includes a resonator element including highly doped silicon and an actuator for exciting the resonator body into a resonance mode having a characteristic frequency-vs-temperature curve. The properties of the resonator element and the actuator are chosen such that the curve has a high-temperature turnover point at a turnover temperature of 85° C. or more. In addition, the oscillator comprises a thermostatic controller for keeping the temperature of the resonator element at said high turnover temperature.