Hydrogenated Amorphous Silicon Outgas Layer for MEMS Pressure Control

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Solution Overview

Problem

The challenge in forming integrated microelectromechanical systems (MEMS) devices on a single substrate is that the outgas layer depletes its outgas species before bonding, leading to a failure in maintaining the desired gas pressure within the MEMS cavities, which affects the quality, stability, and endurance of the devices.

Innovation Solution

An improved outgas layer using hydrogenated amorphous silicon (a-Si:H) with a high composition of hydrogen is employed, which continues to outgas species at high temperatures, ensuring the maintenance of the gas pressure within the MEMS cavities even after bonding and fabrication.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional outgas layer materials are used, then the bonding process can be completed, but the outgas layer depletes its outgas species before bonding, leading to failure in maintaining desired gas pressure within MEMS cavities

Engineering Contradiction:
Improvegas pressure maintenanceVSAvoidoutgas species availability
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The patent changes the material parameter of the outgas layer from conventional materials to hydrogenated amorphous silicon (a-Si:H), which has a fundamentally different outgas behavior. This material parameter change enables continuous outgassing at high temperatures (above 400°C) without depletion, directly resolving the contradiction between maintaining gas pressure and preserving outgas species quantity through the bonding process

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs hydrogenated amorphous silicon (a-Si:H), which is a composite material structure combining silicon with hydrogen atoms. This composite structure allows the material to maintain its outgassing capability at high temperatures while providing structural stability during bonding, thus simultaneously achieving reliable gas pressure maintenance and preserving outgas species availability

Inventive Principle:
Principle #40Composite materials

2Strength

If high temperature bonding is performed, then strong bonding is achieved, but the outgas layer depletes outgas species before bonding completes

Engineering Contradiction:
Improvebonding strengthVSAvoidgas pressure maintenance
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent changes the thermal parameter behavior of the outgas layer by selecting hydrogenated amorphous silicon (a-Si:H), which maintains its outgassing function at high temperatures (above 400°C) required for strong bonding. This parameter change allows the system to achieve both strong bonding strength and continued gas pressure maintenance during and after the bonding process

Inventive Principle:
Principle #35Parameter changes

3Reliability

If outgas species are released early, then gas pressure is maintained initially, but the outgas layer depletes before bonding, causing pressure maintenance failure

Engineering Contradiction:
Improvegas pressure maintenanceVSAvoidoutgas layer functionality duration
Core Design Contradiction:
ReliabilityVSDuration of action of stationary object

Solution Approach 1:

The patent fundamentally changes the thermal stability parameter of the outgas layer material to hydrogenated amorphous silicon (a-Si:H), which enables the outgassing action to continue at high temperatures throughout the entire bonding process and beyond. This extends the duration of outgas layer functionality from before-bonding to post-bonding, ensuring continuous gas pressure maintenance throughout the complete fabrication process

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances the quality factor, stability, and endurance of the MEMS devices by maintaining the desired gas pressure, improving the performance and reliability of the integrated chip.

Implementation Method 1

An improved outgas layer using hydrogenated amorphous silicon (a-Si:H) with a high composition of hydrogen is employed, which continues to outgas species at high temperatures

Methodology Applied
Scientific EffectThermal desorption: Desorption

Data Source

PatentUS20230294978A1Structure for microelectromechanical systems (MEMS) devices to control pressure at high temperature
Publication Date: 2023.09.21 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20230294978A1 patent drawing
  • US20230294978A1 patent drawing
  • US20230294978A1 patent drawing

AI summary

Various embodiments of the present disclosure are directed towards an integrated chip including a microelectromechanical systems (MEMS) structure overlying a substrate. A capping structure overlies the MEMS structure. The capping structure at least partially defines a cavity. The MEMS structure is disposed in the cavity. An outgas structure adjacent to the cavity. The outgas structure comprises an amorphous material.