MEMS Outgassing Prevention Structure and Gas Getter

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Solution Overview

Problem

In micro-electro mechanical system (MEMS) package systems, gases outgassing from dielectric materials can affect the operation of MEMS devices by changing the ambient environment, leading to operational issues.

Innovation Solution

Incorporating an outgassing prevention structure, such as a layer of silicon nitride or silicon oxynitride, to reduce gas permeability and prevent gases like oxygen and carbon dioxide from escaping, combined with a gas getter structure that absorbs excess gases, maintaining a stable environment for the MEMS device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If dielectric materials are used in MEMS package systems, then the device structure is formed and electrical insulation is provided, but gases outgas from the dielectric materials into the sealed space, affecting MEMS device operation

Engineering Contradiction:
ImproveMEMS device operation stabilityVSAvoidgas outgassing
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

A barrier layer is introduced as an intermediary between the dielectric material and the sealed space. This barrier layer selectively blocks gas molecules from migrating through the dielectric material into the sealed cavity, while maintaining electrical insulation and structural integrity. The barrier layer acts as a mediator that prevents the harmful interaction between outgassing dielectric materials and the MEMS device environment.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The package structure employs composite materials by combining dielectric materials with a barrier layer having different gas permeability properties. This composite structure leverages the electrical insulation properties of the dielectric material while utilizing the gas-blocking properties of the barrier layer, creating a multi-functional package structure that addresses both electrical and environmental requirements.

Inventive Principle:
Principle #40Composite materials

2Reliability

If the sealed space is vacuumed to improve MEMS device operation, then the ambient environment is optimized, but gases can still permeate through dielectric materials into the space over time

Engineering Contradiction:
ImproveMEMS device performanceVSAvoidambient environment stability
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The barrier layer is incorporated into the package structure before sealing, creating a pre-established gas blocking pathway. This preliminary protective measure ensures that even before vacuuming occurs, the barrier layer is in place to prevent gas permeation, thereby maintaining long-term environmental stability without requiring repeated vacuuming or environmental adjustments.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The barrier layer serves as a permanent intermediary that continuously prevents gas molecules from penetrating through the dielectric material into the sealed space. This mediator maintains the vacuum environment stability over extended periods by blocking the permeation pathway, eliminating the need for frequent environmental reconditioning.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If thicker dielectric layers are used to improve electrical insulation, then electrical performance is enhanced, but the amount of outgassing material increases, worsening the gas contamination problem

Engineering Contradiction:
Improveelectrical insulationVSAvoidoutgassing material volume
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The dielectric structure is segmented by introducing a thin barrier layer within or adjacent to the dielectric material. This segmentation creates distinct functional zones: the dielectric material provides electrical insulation while the barrier layer provides gas blocking. This allows the use of thicker dielectric layers for improved electrical insulation without proportionally increasing outgassing, as the barrier layer intercepts gas molecules before they can migrate into the sealed space.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The barrier layer acts as a mediator that decouples the relationship between dielectric thickness and outgassing volume. By inserting this intermediate gas-blocking layer, the system can utilize thicker dielectric materials for enhanced electrical insulation while the barrier layer prevents the corresponding increase in outgassing material from contaminating the sealed environment.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The outgassing prevention structure effectively maintains a stable ambient around the MEMS device, reducing operational interference and ensuring consistent performance, while the gas getter structure further minimizes gas presence, enhancing the reliability and accuracy of MEMS devices.

Implementation Method 1

Incorporating an outgassing prevention structure, such as a layer of silicon nitride or silicon oxynitride, to reduce gas permeability and prevent gases like oxygen and carbon dioxide from escaping

Methodology Applied
Scientific EffectGas permeability reduction: Diffusion Barrier

Implementation Method 2

combined with a gas getter structure that absorbs excess gases, maintaining a stable environment for the MEMS device

Methodology Applied
Scientific EffectGas absorption: Absorption (physical)

Data Source

PatentUS8716852B2Micro-electro mechanical systems (MEMS) having outgasing prevention structures and methods of forming the same
Publication Date: 2014.05.06 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US8716852B2 patent drawing
  • US8716852B2 patent drawing
  • US8716852B2 patent drawing

AI summary

A device includes a capping substrate bonded with a substrate structure. The substrate structure includes an integrated circuit structure. The integrated circuit structure includes a top metallic layer disposed on an outgasing prevention structure. At least one micro-electro mechanical system (MEMS) device is disposed over the top metallic layer and the outgasing prevention structure.