MEMS Package Embedding Electronics in Dielectric Base
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Solution Overview
Problem
Current MEMS packaging technologies face challenges in achieving efficient, cost-effective, and compact integration of MEMS components with electronic modules, often resulting in separate fabrication and higher power requirements due to the separation of sensor/actuator and controller components.
Innovation Solution
A package architecture using a dielectric base structure with conductive contacting elements allows for simultaneous mechanical and electrical fastening, enabling a compact design by embedding electronic modules within a PCB substrate, which can include MEMS components, and using a flexible cover structure for shielding and environmental protection, facilitating batch production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If MEMS components and electronic control ICs are fabricated separately on different substrates, then manufacturing flexibility and component optimization are improved, but device complexity and assembly complexity increase
Solution Approach 1:
The patent merges the MEMS component and electronic control IC onto a single substrate by forming the control IC directly on the same substrate as the MEMS component. This integration eliminates the need for separate fabrication and assembly processes, reducing device complexity while maintaining the ability to optimize both components independently through selective material and process choices.
2Device complexity
If MEMS components and electronic control ICs are integrated on the same substrate, then device complexity and assembly steps are reduced, but manufacturing flexibility and component optimization are limited
Solution Approach 1:
The patent applies local quality by using different material layers and processing conditions in different regions of the substrate. The MEMS component area uses materials and processes optimized for mechanical sensing/actuation, while the control IC area uses standard semiconductor fabrication processes, allowing each component to be optimized independently despite being on the same substrate.
3Ease of operation
If electronic modules are mounted on the surface of the base structure, then ease of assembly is improved, but package height and lateral extent increase
Solution Approach 1:
The patent embeds the electronic module within a cavity formed in the base structure, rather than mounting it on the surface. This nesting approach allows the electronic module to be housed inside the base structure volume, reducing the overall package height while maintaining assembly simplicity through the cavity formation process.
4Productivity
If through holes are created in the base structure for component embedding, then integration density is improved, but manufacturing complexity and production time increase
Solution Approach 1:
The patent forms the cavity for embedding the electronic module during the initial substrate processing steps, before the MEMS component fabrication is completed. This preliminary action allows the cavity to be prepared in advance, eliminating the need for additional through-hole drilling or complex post-processing steps that would increase production time.
Data Source
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AI summary
The invention relates to a package comprising a base structure (102) which comprises an electrically insulating material and/or an electrically conductive contact structure (110), an electronic component (104) which is embedded in the base structure (102) or on the base structure (102), a microelectromechanical system (MEMS) component (106) and a cover structure (108) which is mounted on the base structure (102) to at least partially cover the MEMS component (106)