MEMS Package Heaters for Controlled Bonding
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Solution Overview
Problem
Micromirror array devices in spatial light modulators are sensitive to contamination and degradation due to improper heat application during packaging, which can cause mechanical failure and thermal activation of particles.
Innovation Solution
A packaging method using substrates with integral heaters along their periphery to generate heat for melting sealing mediums, ensuring controlled bonding without damaging the micromirror array devices, and incorporating metallization layers for enhanced adhesion and thermal compatibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If heat is applied during bonding of sealing mediums, then bonding strength is improved, but micromirror array device may be degraded
Solution Approach 1:
The heating function is segmented from the general bonding process and localized to specific heater regions positioned away from the micromirror array device. This allows heat application for bonding sealing mediums while isolating the micromirror device from direct thermal exposure, thus maintaining bonding strength without degrading device integrity.
Solution Approach 2:
Heaters serve as intermediary elements that mediate the bonding process by providing localized heat to sealing mediums through metallization layers, while the physical positioning and thermal management prevent direct heat transfer to the micromirror array device, resolving the contradiction between achieving strong bonds and protecting device integrity.
2Strength
If heat is applied during bonding, then sealing medium bonding is improved, but particles may be thermally activated and diffuse
Solution Approach 1:
The heating is applied locally to specific regions where sealing mediums require bonding, rather than uniformly heating the entire package. This localized heat application achieves adequate bonding strength while limiting thermal exposure in regions containing particles, preventing thermal activation and diffusion of particles.
Solution Approach 2:
The heating process is segmented into localized zones using positioned heaters, allowing bonding operations in specific areas while maintaining lower temperatures in particle-containing regions, thus preventing particle diffusion while achieving necessary bonding.
3Strength
If heat is applied during bonding, then sealing medium bonding is improved, but anti-stiction materials may be decreased
Solution Approach 1:
Heat application is localized to bonding regions through positioned heaters, creating a temperature gradient where sealing mediums receive sufficient heat for bonding while anti-stiction materials in other regions remain below degradation temperatures, preserving their protective properties.
Solution Approach 2:
The thermal field is segmented into bonding zones and protected zones using strategically positioned heaters, allowing independent optimization of bonding strength in sealing regions while maintaining anti-stiction material integrity in device regions through controlled thermal exposure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively seals micromirror array devices without degrading them, maintaining mechanical integrity and preventing thermal activation of particles, thus enhancing the reliability and performance of spatial light modulators.
Implementation Method 1
soldered by at least a heater that is formed along the periphery of the surface of either the first or the second substrate
Implementation Method 2
The first and the second substrates are then bonded through the soldered sealing mediums
Data Source
AI summary
A microelectromechanical device package with integral a heater and a method for packaging the microelectromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate and second substrate, between which a microelectromechanical device, such as a micromirror array device is located. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer is deposited, and heated by the heater so as to bond the first and second package substrates together.