MEMS Package With Metallic-Lined Fluid Conduits
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Solution Overview
Problem
Current MEMS package technologies face challenges in effectively interconnecting fluid passageways and electrical circuitry between MEMS devices, leading to issues with fluid pressure management and electrical connectivity, particularly in ensuring leak-tight connections and efficient fluid flow.
Innovation Solution
The development of a MEMS package platform that includes a die carrier substrate with fluid conduits lined with a metallic material for leak-tight connections, combined with a burst cap for pressure reinforcement and a die cap for component protection, along with a method of forming electrical connections using conductive pathways and solder pads, enables efficient fluid and electrical interconnection between MEMS devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If fluid passageways are interconnected between MEMS devices, then fluid flow efficiency is improved, but fluid leakage risk increases
Solution Approach 1:
The patent introduces an intermediary sealing structure at the interface between MEMS devices and the package substrate. This sealing layer acts as a mediator that prevents fluid leakage while maintaining efficient fluid flow through the interconnected passageways. The sealing structure is positioned at the critical junction where fluid pathways connect, blocking leakage paths without obstructing the intended fluid flow.
Solution Approach 2:
The package structure employs composite materials combining different properties: the package substrate provides structural support, while integrated sealing materials (such as epoxy, polymer, or metal seals) provide leak-tight barriers. This composite approach allows the system to simultaneously achieve mechanical strength for structural integrity and sealing properties for leak prevention, resolving the contradiction between flow efficiency and leakage risk.
2Productivity
If electrical circuitry is interconnected between MEMS devices, then electrical connectivity is improved, but electrical interference increases
Solution Approach 1:
The patent introduces intermediary elements in the electrical interconnection system: ground shields and reference planes act as mediators between signal traces. These intermediary structures provide a controlled impedance environment and serve as barriers that prevent electromagnetic interference while maintaining electrical connectivity. The ground shields are positioned adjacent to signal pathways to block interference without obstructing signal transmission.
Solution Approach 2:
The patent creates an electrically inert environment through the use of ground planes and shielding structures that form a controlled electromagnetic environment. This inert electrical atmosphere isolates sensitive signal pathways from external and internal electromagnetic interference, allowing high-speed electrical connections between MEMS devices without suffering from cross-talk or noise contamination.
3Volume of stationary object
If package structure is made compact, then space utilization is improved, but pressure management capability deteriorates
Solution Approach 1:
The patent applies local quality by providing pressure management features only where needed within the compact package. Burst caps are strategically positioned at specific high-pressure zones or fluid accumulation points rather than throughout the entire package. Pressure relief channels are localized to critical areas, allowing effective pressure management in a compact volume by concentrating protective features where they are most needed rather than distributing them uniformly.
Solution Approach 2:
The patent employs nesting by integrating pressure management features within the compact package structure. Burst caps are nested within or integrated with the package substrate layers. Pressure relief channels are routed through existing structural elements. This nesting approach allows pressure management functionality to be incorporated into the compact package without significantly increasing the overall volume, as the pressure management features are embedded within the existing structure rather than adding external components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures reliable fluid communication and electrical connectivity between MEMS devices, preventing pressure imbalances and ensuring efficient fluid flow while maintaining a compact and robust package structure.
Implementation Method 1
fluid conduits lined with a metallic material for leak-tight connections
Implementation Method 2
method of forming electrical connections using conductive pathways and solder pads
Data Source
AI summary
A method of manufacturing a MEMS package includes initially providing a substrate formed of a first material and defining a bore therein. The bore is substantially completely lined with a second material that is different from the first material. A micromachined component having a fluid passageway formed therein is affixed to the substrate such that the bore and the fluid passageway are in fluid communication.