MEMS Package Metallic Sealing for Oxidation-Resistant Interconnects

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Solution Overview

Problem

Integration of LiNbO3 or LiTaO3-based microelectromechanical devices with silicon-based packages faces challenges in structural strength and reliability due to oxidation and pollution of metal connection structures exposed to the environment, leading to signal transmission issues and reduced package reliability.

Innovation Solution

A semiconductor package design featuring a substrate with a metallic sealing structure surrounding the interconnection structure between the substrate and microelectromechanical device, which enhances structural strength, reliability, and hermetic sealing, while reducing signal loss by shortening the signal transmission path and preventing oxidation through environmental humidity blocking.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If metal connection structures are exposed to the environment for connection, then ease of manufacture and assembly is improved, but the metal connection structure is oxidized or polluted, reducing reliability

Engineering Contradiction:

Improveease of manufactureVSAvoidreliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent introduces an inert atmosphere or vacuum environment within the package enclosure to prevent oxidation and pollution of metal connection structures. The enclosure creates a protected environment that isolates sensitive metal components from harmful atmospheric elements while maintaining manufacturing accessibility.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Solution Approach 2:

The patent employs sealing structures and protective barriers as intermediaries between the metal connection structures and the external environment. These intermediary elements prevent direct contact between metal surfaces and harmful environmental factors, thereby maintaining reliability without compromising manufacturing ease.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of operation

If metal connection structures are exposed to the environment, then assembly process is simplified, but signal transmission quality deteriorates due to oxidation and pollution

Engineering Contradiction:

Improveease of operationVSAvoidsignal transmission

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The package enclosure creates an inert atmosphere that protects metal connection structures from oxidation and pollution, ensuring stable signal transmission. This approach maintains ease of assembly while preventing degradation of electrical performance over time.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Solution Approach 2:

The patent employs disposable or replaceable sealing elements that provide temporary protection during assembly and long-term protection during operation. These sealing structures are designed to be cost-effective and can be replaced if needed, maintaining signal transmission quality without complicating the assembly process.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Adaptability or versatility

If LiNbO3 or LiTaO3 materials are used for microelectromechanical devices, then device functionality is achieved, but integration with silicon-based packages becomes difficult, reducing structural strength

Engineering Contradiction:

Improvedevice functionalityVSAvoidstructural strength

Core Design Contradiction:

Adaptability or versatilityVSStrength

Solution Approach 1:

The patent employs composite material structures that combine LiNbO3 or LiTaO3 microelectromechanical devices with silicon-based package substrates. Through carefully designed interface structures and bonding methods, the patent achieves both functional performance and structural strength by integrating materials with different properties into a unified composite system.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent divides the package structure into separate functional modules, allowing LiNbO3/LiTaO3 devices to be manufactured and tested independently before integration with silicon-based packages. This segmentation enables optimized design for each material type while maintaining overall structural integrity through standardized interface connections.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The metallic sealing structure improves the structural integrity and reliability of the semiconductor package, reduces signal loss, and prevents oxidation of the interconnection structure, thereby enhancing the overall performance and longevity of the package.

Implementation Method 1

preventing oxidation through environmental humidity blocking

Methodology Applied

Scientific EffectOxidation prevention through humidity blocking: Oxidation

Data Source

PatentUS11784110B2Semiconductor package and method for manufacturing the same

Publication Date: 2023.10.10 ADVANCED SEMICON ENG INC

AI summary

A semiconductor package may include a substrate; a microelectromechanical device disposed on the substrate; an interconnection structure connecting the substrate to the microelectromechanical device; and a metallic sealing structure surrounding the interconnection structure.