MEMS Package Sealing Structure Without an Extra Substrate
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Solution Overview
Problem
The formation of a sealed space for MEMS components, such as surface acoustic wave filters, is complex and expensive due to the need for additional substrates, which increases fabrication costs and thickness.
Innovation Solution
A MEMS device package design that integrates a partition wall with the circuit layer and conductive pillars to enclose a space without an extra substrate, using a polymeric dielectric layer to seal the space while reducing thickness and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an additional substrate is used to form a sealed space for MEMS components, then the sealing effectiveness is improved, but the fabrication cost and package thickness increase
Solution Approach 1:
The patent merges the sealing function with the existing circuit board structure by integrating a sealing layer and partition wall into the circuit board's multi-layer construction. This eliminates the need for a separate additional substrate, thereby reducing fabrication cost and complexity while maintaining effective sealing of the MEMS component space.
Solution Approach 2:
The circuit board is designed to serve multiple functions simultaneously: it provides electrical connectivity through conductive layers, structural support through the substrate, and sealing through the integrated sealing layer and partition wall. This multi-functionality eliminates the need for a dedicated separate sealing substrate, reducing overall device complexity.
2Reliability
If an additional substrate is used to form a sealed space for MEMS components, then the sealing effectiveness is improved, but the package thickness increases
Solution Approach 1:
The sealing functionality is merged into the circuit board's existing multi-layer structure. The sealing layer and partition wall are integrated as part of the circuit board's construction, eliminating the need for an additional separate substrate. This integration maintains effective sealing while reducing the overall package thickness.
3Object-affected harmful factors
If a traditional sealed space structure is used, then the acoustic wave interference is reduced, but the fabrication process becomes more complex
Solution Approach 1:
The sealing structure is merged with the circuit board's existing manufacturing process. The partition wall and sealing layer are formed as part of the circuit board's multi-layer construction sequence, utilizing standard lamination and etching processes. This integration reduces fabrication process complexity while maintaining effective acoustic wave interference protection.
Data Source
AI summary
A Micro Electro-Mechanical System (MEMS) device package includes a first circuit layer, a partition wall, a MEMS component, a second circuit layer and a polymeric dielectric layer. The partition wall is disposed over the first circuit layer. The MEMS component is disposed over the partition wall and electrically connected to the first circuit layer. The first circuit layer, the partition wall and the MEMS component enclose a space. The second circuit layer is disposed over and electrically connected to the first circuit layer. The polymeric dielectric layer is disposed between the first circuit layer and the second circuit layer.