MEMS Packaging Self-Aligning Bonding Structure
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Solution Overview
Problem
The existing methods for hermetically sealing MEMS elements require complex and costly alignment mechanisms, necessitating special alignment marks on both the substrate and sealing cap, which increases manufacturing costs.
Innovation Solution
A self-aligning method using a substrate with concave portions and a sealing cap with ring-shaped protruded bonding portions, allowing for easy bonding without the need for complex alignment mechanisms or special alignment marks, utilizing anodic bonding for silicon and glass materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If alignment marks are formed on both the substrate and sealing cap using complex alignment mechanisms, then positioning precision is improved, but manufacturing cost increases
Solution Approach 1:
The sealing cap structure itself serves as the alignment mechanism through its geometry. The cap includes a positioning protrusion that fits into a positioning groove on the substrate, enabling self-alignment without external alignment marks or complex positioning systems. This self-aligning mechanism eliminates the need for separate alignment procedures while maintaining high positioning precision.
Solution Approach 2:
The alignment function is extracted from the traditional alignment mark system and integrated directly into the sealing cap structure. By incorporating positioning protrusions and grooves as inherent features of the cap design, the patent removes the need for separate alignment marks on both surfaces, simplifying the manufacturing process while preserving alignment accuracy.
2Manufacturing precision
If special alignment marks are formed on substrate and sealing cap, then alignment accuracy is improved, but manufacturing complexity increases
Solution Approach 1:
The alignment function is merged with the sealing cap structure by integrating positioning protrusions and grooves directly into the cap geometry. This combination eliminates the need for separate alignment marks and complex alignment mechanisms, reducing manufacturing complexity while maintaining alignment accuracy through the inherent geometric relationship between the protrusion and groove.
3Manufacturing precision
If recognition camera and software are used for alignment, then positioning precision is improved, but manufacturing cost increases
Solution Approach 1:
The sealing cap structure itself serves as the alignment mechanism through its geometry. The cap includes a positioning protrusion that fits into a positioning groove on the substrate, enabling self-alignment without external alignment marks or complex positioning systems. This self-aligning mechanism eliminates the need for separate alignment procedures while maintaining high positioning precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces manufacturing costs by eliminating the need for expensive alignment systems and special mark formation, enabling cost-effective hermetic sealing of MEMS elements.
Implementation Method 1
allowing for easy bonding without the need for complex alignment mechanisms or special alignment marks, utilizing anodic bonding for silicon and glass materials
Data Source
AI summary
A method of manufacturing an electronic parts packaging structure, including the steps of preparing an electronic parts forming substrate in which an MEMS element is formed in a formation region and a concave portion is provided in a periphery part of the formation region, and a sealing cap in which a ring-shaped protruded bonding portion is provided in a part corresponding to the concave portion of the electronic parts forming substrate and a cavity is formed in a part corresponding to the formation region; and fitting the protruded bonding portion of the sealing cap into the concave portion of the electronic parts forming substrate. Thus, the MEMS element is hermetically sealed in the cavity of the sealing cap.