MEMS Packaging Structure for Semiconductor Heat Dissipation
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Solution Overview
Problem
There is a need for semiconductor devices that occupy less space, consume less power, and perform higher-quality computing at greater speeds, as consumer demand for advanced ICs continues to grow.
Innovation Solution
The integration of a CMOS-MEMS technology in semiconductor devices, incorporating a MEMS structure with a movable element actuated by piezoelectric materials, enhances heat dissipation through convection and vibration, utilizing a movable element with a comb structure or cantilevered beams to improve cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor circuits are made smaller and more complex to increase computational performance, then computing speed and quality improve, but heat generation increases and power consumption rises
Solution Approach 1:
The patent employs a MEMS structure with movable elements that vibrate to enhance heat dissipation from the semiconductor device, converting thermal energy into mechanical vibration and fluid flow to improve cooling efficiency
Solution Approach 2:
The patent utilizes fluid dynamics through movable elements that displace cooling fluid, creating convection currents and enhancing heat transfer from the semiconductor device to the surrounding cooling medium
2Area of stationary object
If semiconductor circuits are made smaller to occupy less space, then device compactness improves, but heat dissipation becomes more difficult
Solution Approach 1:
The patent integrates a MEMS structure with movable elements that operate in three-dimensional space above the semiconductor circuit, adding a vertical dimension for heat dissipation that does not increase the device's horizontal footprint
Solution Approach 2:
The movable elements vibrate to enhance convective heat transfer, allowing efficient heat dissipation from a compact device volume without requiring increased surface area
3Productivity
If higher computational performance is achieved through more complex circuits, then processing capability improves, but power consumption increases
Solution Approach 1:
The patent converts the harmful waste heat generated by high-performance computing into a useful resource by using it to drive fluid convection and MEMS vibration, thereby improving cooling efficiency without requiring additional power input
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient heat dissipation and reduced power consumption while maintaining high computational performance, addressing the need for compact and efficient semiconductor devices.
Implementation Method 1
a movable element actuated by piezoelectric materials
Implementation Method 2
enhances heat dissipation through convection and vibration
Data Source
AI summary
The present disclosure provides a semiconductor device. The semiconductor device includes: a circuit board; a packaging structure disposed over and bonded to the circuit board; and a MEMS structure disposed over and bonded to the packaging structure and including a movable element. The movable element is movable relative to the packaging structure and the circuit board upon an operation of the packaging structure.