MEMS Packaging with Integrated Sealing and Shielding
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Solution Overview
Problem
Existing MEMS device packaging technologies face challenges in reducing package size, incorporating passive components, and preventing contaminants from reaching the functional structure of the MEMS die.
Innovation Solution
The proposed solution involves a MEMS device package configuration that includes a substrate, a MEMS die with a functional and outer frame structure, a sealing structure, and a conductive shielding structure. The sealing structure is designed to block the movement of air or molding compound from the inner space to the functional structure of the MEMS die, while the conductive shielding structure provides additional protection and defines the inner space of the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If wire bonding process is used to connect dies and substrate, then electrical connection is achieved, but package size cannot be reduced and passive components cannot be added
Solution Approach 1:
The patent merges the sealing structure and conductive shielding structure into a single integrated component that performs multiple functions: sealing the functional structure, providing electromagnetic shielding, and defining the inner space. This consolidation enables smaller package size while maintaining manufacturing feasibility through combined process steps.
Solution Approach 2:
The sealing structure is designed to serve multiple purposes simultaneously: it seals the functional structure against contaminants, provides electromagnetic shielding for the MEMS die, and helps define the inner space of the device. This multi-functionality allows passive components to be incorporated without increasing package size.
2Reliability
If no sealing structure is used, then manufacturing is simpler, but contaminants can enter the functional structure during manufacturing or operation
Solution Approach 1:
The sealing function is merged with the conductive shielding structure, creating a single component that provides both contamination protection and electromagnetic shielding. This integration maintains reliability against contaminants while avoiding the added complexity of separate sealing components.
Solution Approach 2:
The sealing structure acts as an intermediary barrier between the inner space and the functional structure, preventing contaminants from entering during both manufacturing and operation. This intermediate sealing layer protects sensitive functional structures without requiring complex isolation mechanisms.
3Volume of moving object
If package size is reduced, then integration density increases, but passive components become difficult to incorporate
Solution Approach 1:
By merging the sealing structure with the conductive shielding structure, the patent creates efficient use of available space, allowing passive components to be incorporated into the reduced package volume without compromising either sealing effectiveness or electromagnetic protection.
Solution Approach 2:
The patent utilizes three-dimensional packaging architecture, positioning components in multiple layers and dimensions. This allows passive components to be integrated into the reduced package size by exploiting vertical space and multi-dimensional arrangement rather than relying solely on planar area.
Data Source
AI summary
In an aspect, a micro-electromechanical system (MEMS) device includes a substrate, a MEMS die mounted on the substrate, a sealing structure, and a conductive shielding structure over the substrate and covering the MEMS die and the sealing structure. The MEMS die may include a functional structure and an outer frame structure. The conductive shielding structure, the sealing structure, and the substrate may define an inner space of the MEMS device, where the sealing structure may be configured to block movement of air or a molding compound from the inner space to the functional structure of the MEMS die.