MEMS Packaging Structure for Miniaturized Function Integration
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Solution Overview
Problem
Current MEMS package integration methods are limited by large solder pads, making miniaturization and function integration difficult, especially when integrating MEMS dies with different functions on a single wafer.
Innovation Solution
A MEMS package structure with a device wafer and bonded MEMS dies featuring a bonding layer with openings for electrical connections, allowing for reduced size and enhanced function integration by enabling the integration of multiple MEMS dies of various functions on a single wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separately bonding MEMS die-containing wafer and control circuit-containing wafer to a single packaging substrate with solder pads, then electrical connections are achieved, but the reserved solder pad areas are large which is unfavorable to miniaturization
Solution Approach 1:
The patent merges the MEMS die and control circuit onto a single device wafer before bonding to the packaging substrate. This integration eliminates the need for separate solder pads on different wafers, reducing the overall pad area while maintaining electrical connection reliability through direct integration and fewer bonding interfaces.
Solution Approach 2:
The device wafer serves multiple functions: it acts as both the substrate for MEMS die integration and the control circuit mounting platform. This multi-functional design consolidates what would otherwise require separate wafers and their associated solder pads, thereby reducing the total area occupied by connection elements.
2Reliability
If directly bonding MEMS die-containing wafer to control circuit-containing wafer with solder pads, then electrical connections are achieved, but it is difficult to fabricate MEMS dies of different functions on a single wafer and the process becomes complicated and bulky
Solution Approach 1:
The patent combines multiple MEMS dies of different functions and the control circuit onto a single device wafer using a unified integration process. This approach simplifies the overall integration complexity by eliminating the need to separately bond multiple wafer pairs, while still achieving reliable electrical connections through the integrated architecture.
Solution Approach 2:
The device wafer is segmented into multiple functional regions, each accommodating different types of MEMS dies or control circuit elements. This segmentation allows diverse functions to be integrated on a single wafer without requiring complex multi-wafer bonding, reducing process complexity while maintaining connection reliability.
3Adaptability or versatility
If separately bonding wafers containing MEMS dies of different functions to wafers containing respective control circuits, then functional integration is achieved, but the resulting MEMS device is bulky in size
Solution Approach 1:
The patent merges multiple MEMS dies of different functions and their associated control circuits onto a single device wafer. This consolidation reduces the overall device volume by eliminating the need for multiple separate wafer bonds and their associated interconnection structures, while preserving full functional integration capability.
Solution Approach 2:
The device wafer acts as a nested container that integrates multiple MEMS dies and control circuit elements within its structure. This nesting approach allows diverse functional elements to be compactly arranged on a single substrate, reducing the overall device volume compared to separate wafer bonding approaches.
Data Source
AI summary
A micro-electro-mechanical system (MEMS) package structure and a method for fabricating the MEMS package structure. The MEMS package structure includes a MEMS die (200) and a device wafer (100). A control unit and an interconnection structure (300) are formed in the device wafer (100), and a first contact pad (410) and an input-output connecting member (420) are formed on a first bonding surface (100a) of the device wafer (100). The MEMS die (200) is coupled to the first bonding surface (100a) through a bonding layer (500). The MEMS die (200) includes a closed micro-cavity (220) and a second contact pad (220). The first contact pad (410) is electrically connected to a corresponding second contact pad (220). An opening (510) that exposes the input-output connecting member (420) is formed in the bonding layer (500). The MEMS package structure allows electrical interconnection between the MEMS die (200) and the device wafer (100) with a reduced package size, compared to those produced by existing integration techniques. In addition, function integration ability of the package structure is improved by integrating a plurality of MEMS dies of the same or different structures and functions on the same device wafer.