Pre-released MEMS Structure with Spacer Anchoring
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Solution Overview
Problem
Existing MEMS and NEMS production methods require numerous release holes, which weaken the structures and prolong the release process, and existing anti-sticking mechanisms are inefficient in preventing element sticking during operation.
Innovation Solution
A pre-released structure with a closed cavity and spacers between stacks allows for faster release without additional holes, providing mechanical support and reducing sticking risks through optimized spacer density and design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If numerous release holes are made in the useful layer to remove the oxide layer, then the oxide layer can be completely removed to release the MEMS, but the structure is weakened and the process time is prolonged
Solution Approach 1:
The oxide layer removal is segmented into two distinct phases: first, bulk removal through release holes to eliminate most of the oxide layer; second, precision removal of remaining oxide at critical interfaces using targeted etching. This segmentation allows efficient bulk removal while preserving structural integrity by minimizing the number of release holes needed.
Solution Approach 2:
The method performs preliminary bulk removal of the oxide layer through release holes before final interface cleaning. By removing the majority of the oxide layer in advance, the subsequent precision etching step requires minimal intervention, thereby reducing overall process time while maintaining structural integrity.
2Reliability
If numerous release holes are made in the useful layer, then the oxide layer can be accessed for removal, but the structure is weakened
Solution Approach 1:
The method extracts and removes only the essential portions of the oxide layer that prevent proper adhesion, rather than removing the entire oxide layer. By taking out only the necessary oxide material at critical interfaces, the process achieves effective adhesion without requiring numerous release holes that would weaken the structure.
Solution Approach 2:
The etching process is applied locally at specific interfaces where adhesion problems occur, rather than uniformly across the entire structure. This localized approach removes oxide only where necessary, preserving the structural strength of the useful layer while ensuring proper adhesion at critical locations.
3Reliability
If a long etching duration is used to remove the oxide layer, then complete removal is achieved, but the production time is significantly increased
Solution Approach 1:
The method rushes through the bulk oxide removal phase quickly using release holes, then focuses time and resources on the critical final interface cleaning. By skipping the time-consuming uniform etching process and directly targeting remaining oxide at adhesion-critical interfaces, the process achieves reliable adhesion with significantly reduced total etching duration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables quicker and more robust release of MEMS and NEMS structures with reduced mechanical weakening and enhanced anti-sticking performance, allowing for high-density spacer anchoring and stress resistance.
Implementation Method 1
at least one spacer arranged in the cavity and extending between the portion of the first stack and the second stack, that is to say connecting or joining the portion of the first stack to the second stack
Data Source
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AI summary
Device (100) with a pre-released structure comprising at least: - at least one first stack, comprising at least one first layer (102) based on at least one first material, disposed against a second stack comprising at least one second layer (104) based on at least one second material, - at least one closed cavity (112), made in the first and/or the second stack, and disposed between a portion (114) of the first stack forming the pre-released structure and the second stack, - at least one spacer (116) disposed in the cavity (112) and connecting the portion (114) of the first stack to the second stack.