MEMS Pressure Sensor Conductive Bonding Integration

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Solution Overview

Problem

Traditional capacitive MEMS pressure sensors have complex packaging processes, larger size, higher costs, and vulnerable sensitive diaphragms due to discrete chip manufacturing and packaging challenges, which are not compatible with mature IC manufacturing technologies.

Innovation Solution

A MEMS pressure sensor design involving two substrates, one with a capacitive pressure sensing unit and the other with a signal processing circuit, bonded together using conductive bonding layers, allowing for separate manufacturing and integration compatible with IC processes, reducing size and cost while protecting the sensitive diaphragm.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional discrete chip manufacturing method is used, then the sensitive diaphragm can be manufactured, but the packaging process becomes complicated and the device size increases

Engineering Contradiction:

Improvesensitive diaphragm protectionVSAvoidpackaging process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the pressure sensor chip and signal processing circuit chip into a single integrated substrate. The sensitive diaphragm, bonding layers, and circuit elements are all fabricated on the same substrate, eliminating the need for separate packaging of discrete chips and simplifying the overall packaging process while protecting the sensitive diaphragm.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent segments the device into functional layers on a single substrate: the sensitive diaphragm layer, intermediate bonding layers, and circuit layers. This segmentation allows each component to be manufactured and positioned precisely while maintaining protection of the sensitive diaphragm through the layered structure.

Inventive Principle:

Principle #1Segmentation

2Reliability

If traditional discrete chip manufacturing method is used, then the pressure sensor can be manufactured, but the manufacturing cost increases

Engineering Contradiction:

Improvesensor functionalityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

By combining multiple chips into a single integrated substrate, the patent reduces the number of packaging steps, bonding operations, and assembly processes required. This integration significantly lowers manufacturing costs while maintaining full sensor functionality including the sensitive diaphragm and signal processing circuits.

Inventive Principle:

Principle #5Merging (Combining)

3Measurement precision

If sensitive diaphragm is placed on the uppermost surface of the chip, then the pressure sensing function is achieved, but the diaphragm becomes vulnerable to damage during substrate thinning and packaging

Engineering Contradiction:

Improvepressure sensing capabilityVSAvoiddiaphragm durability

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The patent relocates the sensitive diaphragm from the uppermost surface to an intermediate layer within the substrate structure. By positioning the diaphragm between the first bonding layer and the second bonding layer, it is protected from damage during substrate thinning and packaging operations while maintaining its pressure sensing capability through capacitive detection.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

4Adaptability or versatility

If separate packaging of pressure sensor chip and signal processing circuit chip is performed, then the functional requirements are met, but the device size increases

Engineering Contradiction:

Improvefunctional requirementsVSAvoiddevice size

Core Design Contradiction:

Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The patent integrates the pressure sensor chip and signal processing circuit chip onto a single substrate, eliminating the need for separate packaging of two discrete chips. This integration dramatically reduces the overall device size and volume while maintaining all required functions including pressure sensing, signal processing, and protective encapsulation.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies the packaging process, reduces device size, and lowers costs by enabling separate manufacturing of substrates, while protecting the sensitive diaphragm and improving compatibility with IC manufacturing technologies.

Implementation Method 1

both the first bonding layer and the second bonding layer are formed of a conductive material

Methodology Applied

Scientific EffectConductive material adhesion: Adhesive

Data Source

PatentUS9073745B2MEMS pressure sensor and manufacturing method therefor

Publication Date: 2015.07.07 MEMSEN ELECTRONICS

AI summary

A Micro Electromechanical System (MEMS) pressure sensor may include a first substrate provided with a sensitive diaphragm of a capacitive pressure sensing unit, an electrical connecting layer and a first bonding layer on a surface of the first substrate; and a second substrate provided with an inter-conductor dielectric layer, a conductor connecting layer in the inter-conductor dielectric layer and/or a second bonding layer on a surface of the second substrate. The second substrate is arranged opposite to the first substrate, and the second substrate is fixedly coupled to the first substrate via the first bonding layer and the second bonding layer; a pattern of the first bonding layer is corresponding to a pattern of the second bonding layer, and both the first bonding layer and the second bonding layer are formed of a conductive material.