MEMS Pressure Sensor Assembly With Diaphragm Cushioning

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Solution Overview

Problem

Medical devices with integrated micro-electromechanical system (MEMS) sensors are susceptible to damage from external forces during insertion, removal, and use, leading to performance degradation and increased procedural times.

Innovation Solution

A medical device with a pressure sensor assembly incorporating a MEMS chip, a housing, and a material that covers the diaphragm, which includes a material with elasticity or viscosity to transfer force and protect the sensor from damage, along with a housing design that includes insulating materials and conductive passages to ensure electrical connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a MEMS sensor is integrated into a medical device, then measurement precision is improved, but reliability deteriorates due to susceptibility to damage from external forces

Engineering Contradiction:
Improvepressure measurement precisionVSAvoidsensor reliability
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

A material with elasticity or viscosity is positioned between the diaphragm and the external environment to absorb and dissipate external forces before they reach the MEMS sensor. This cushioning material prevents direct transmission of impact forces during insertion, removal, or use, thereby protecting the sensor while maintaining its measurement precision.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The elastic or viscous material acts as an intermediary element between the external environment and the MEMS sensor. It transfers pressure measurements to the sensor while filtering out harmful external forces, thus serving as a protective mediator that maintains both reliability and measurement precision.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If a protective material is added to cover the diaphragm, then reliability is improved, but device complexity increases

Engineering Contradiction:
Improvesensor protectionVSAvoidsensor assembly complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

A thin film or shell of elastic material is used to cover the diaphragm, providing protection against external forces while maintaining a simple and compact structure. This flexible protective layer integrates seamlessly with the existing sensor design without adding significant complexity.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The protective assembly uses composite construction combining the MEMS chip, the elastic/viscous protective material, and the housing in a integrated unit. This composite approach provides robust protection while maintaining manufacturing simplicity through unified assembly design.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively protects the MEMS sensor from external forces, maintaining sensor accuracy and reducing procedural time by preventing damage and ensuring precise pressure and temperature measurements during medical procedures.

Implementation Method 1

The material may have an elasticity or viscosity that permits transfer of force therethrough

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

The material may have an elasticity or viscosity that permits transfer of force therethrough

Methodology Applied
Scientific EffectViscosity: Viscometer

Implementation Method 3

the material may include a pigment that inhibits passage of electromagnetic radiation therethrough

Methodology Applied
Scientific EffectAbsorption (EM radiation): Absorption (EM radiation)

Implementation Method 4

The second body may include an insulating material and a plurality of passages

Methodology Applied
Scientific EffectElectrical Resistance: Electrical Resistance

Implementation Method 5

each passage may house a conductor that electrically connects the MEMS chip to a corresponding electrical conductor extending proximally through the shaft

Methodology Applied
Scientific EffectConduction (electrical): Conduction (electrical)

Implementation Method 6

A coefficient of thermal expansion of the first material may be approximately the same as a coefficient of thermal expansion of the second material

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS20250387011A1Medical devices and systems with sensors and related methods
Publication Date: 2025.12.25 BOSTON SCIENTIFIC SCIMED INC
  • US20250387011A1 patent drawing
  • US20250387011A1 patent drawing
  • US20250387011A1 patent drawing

AI summary

Medical devices and systems having a micro-electromechanical system (MEMS) assembly are described herein. The medical device may include a shaft extending to a distal end and a pressure sensor assembly incorporated into the shaft. The pressure sensor assembly may include a housing, a MEMS chip, and a material. The housing may define a chamber and include a first body coupled to a second body, e.g., the first body defining at least one opening in fluid communication with the chamber. The MEMS chip may include a diaphragm. The material may at least partially cover the diaphragm and have an elasticity or viscosity that permits transfer of force therethrough. The pressure sensor assembly may be configured to measure pressure external to the medical device.