MEMS Pressure Sensor Waterproofing via Unitary Lid Flange
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Solution Overview
Problem
Existing MEMS pressure sensor modules require the use of O-rings for waterproofing, which introduces manufacturing complexities and costs, as well as potential malfunctions.
Innovation Solution
A waterproof MEMS pressure sensor module is achieved by using a unitary lid with a wide flange that is glued to an organic substrate, eliminating the need for an O-ring and providing effective sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an O-ring is used for waterproofing the MEMS pressure sensor, then the sensor can be made waterproof, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent removes the O-ring component entirely from the waterproofing system. Instead of adding an O-ring to achieve waterproofing, the invention extracts this component and replaces it with a molded sealing structure integrated into the housing, thereby reducing manufacturing complexity while maintaining waterproofing reliability
Solution Approach 2:
The housing is designed with an integrated sealing structure where the sealing function is merged into the housing itself rather than being a separate component. The housing includes a molded sealing bead or lip that directly contacts the sensor package, combining the housing and sealing functions into a single integrated structure
2Reliability
If an O-ring is used for waterproofing, then the sensor can be sealed, but additional costs and potential malfunction sources are introduced
Solution Approach 1:
The O-ring component is extracted and eliminated from the design. The sealing function is achieved through a molded integral feature of the housing, which reduces the number of parts, assembly steps, and potential failure points while improving manufacturing ease through single-mold or co-molded production
Solution Approach 2:
The housing structure provides its own sealing capability through an integrated sealing bead or lip that is molded as part of the housing. This self-service approach eliminates the need for separate sealing components like O-rings, reducing assembly complexity and improving manufacturing ease
3Reliability
If space is allocated for an O-ring position, then waterproofing can be achieved, but the thickness of components increases
Solution Approach 1:
The sealing function is merged into the housing structure itself through an integrated sealing bead or lip. This eliminates the need for a separate O-ring groove and the thickness required to accommodate an O-ring, reducing overall component thickness while maintaining waterproofing capability
Solution Approach 2:
The sealing mechanism transitions from a radial O-ring configuration requiring axial space to an integrated molded feature that utilizes the housing wall thickness more efficiently. The sealing bead is formed as a dimensional feature of the housing itself, reducing the overall axial thickness required
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a cost-effective and reliable waterproofing method for MEMS pressure sensor modules, reducing manufacturing complexities and potential malfunctions associated with O-ring usage.
Implementation Method 1
The wide flange is glued to the substrate in a manner that effectively seals and waterproofs the MEMS pressure sensor without the use of an O-ring
Data Source
Figure 1
Figure 2A
Figure 2B
AI summary
A sensor module 107 includes an organic substrate 106, a MEMS pressure sensor 101 mounted to the organic substrate, and a unitary lid 108 mounted on the substrate. The unitary lid 108 includes a central elevated portion 110 housing the MEMS pressure sensor, an aperture 114 in the central elevated portion, and a flat flange 112 extending from the central elevated portion to an edge of the organic substrate.