Microelectromechanical Pressure Sensor Testing via Reference Curve Comparison
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Solution Overview
Problem
Existing methods for testing microelectromechanical semiconductor components, particularly pressure sensors, are complex and require significant equipment modifications, limiting pressure range and setup versatility, and often necessitate additional hardware like force sensors for calibration.
Innovation Solution
A method using a structurally identical reference pressure sensor and a distance-controlled deflection plunger to determine the critical pressure at which the measuring element breaks, allowing for comparison with the tested sensor's deformation characteristics to assess its ability to withstand higher pressures without breaking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a force sensor is used to mechanically act upon the pressure-sensitive measuring element with predeterminable force, then the measurement precision is improved, but the device complexity increases due to additional hardware costs and calibration requirements
Solution Approach 1:
The patent replaces the mechanical force sensor system with an electrical voltage source system. Instead of using a force sensor to apply mechanical force, the invention uses a voltage source to generate a test voltage that is applied to the measuring element, thereby substituting a mechanical measurement system with an electrical one that is simpler and more precise.
Solution Approach 2:
The patent uses a reference pressure sensor with known characteristics to create a reference curve that serves as a template for evaluating test pressure sensors. By copying the structural design and using it to establish reference data, the system eliminates the need for complex force measurement while maintaining measurement precision through comparison with the reference curve.
2Measurement precision
If the wafer prober test assembly is substantially modified with additional equipment, then the measurement capability is improved, but the ease of operation deteriorates due to complex test setups
Solution Approach 1:
The patent makes the wafer prober test assembly universal by enabling it to test both integrated circuits and microelectromechanical semiconductor components using the same basic equipment. The test method can be applied to different component types without substantial modification, allowing one test assembly to serve multiple functions and simplifying operation.
Solution Approach 2:
The patent replaces complex mechanical pressure application systems with a simple voltage-based testing system. By substituting mechanical force sensors and pressure application mechanisms with electrical voltage sources and evaluation circuits, the system becomes easier to operate while maintaining enhanced measurement capability.
3Manufacturing precision
If different test setups are used for various thicknesses of pressure-sensitive measuring elements, then the manufacturing precision is improved, but the device complexity increases
Solution Approach 1:
The patent creates a universal test method that can evaluate pressure sensors with different measuring element thicknesses using the same test setup. By applying voltage to the measuring element and evaluating the electrical characteristics, the system can assess manufacturing precision across various thicknesses without requiring different mechanical test configurations.
Solution Approach 2:
The patent replaces thickness-specific mechanical test setups with a universal electrical testing system. Instead of using different mechanical pressure application methods for different thicknesses, the invention uses voltage application and electrical signal evaluation that works across various thicknesses, thereby maintaining manufacturing precision assessment while reducing device complexity.
4Strength
If the critical pressure is determined by mechanically acting with predeterminable force until breakage, then the strength measurement is improved, but the loss of time increases due to calibration requirements
Solution Approach 1:
The patent replaces time-consuming mechanical force application and calibration with rapid electrical voltage testing. By applying voltage to the measuring element and evaluating electrical signals, the system determines strength characteristics without the time loss associated with mechanical sensor calibration and force application procedures.
Solution Approach 2:
The patent uses a reference pressure sensor to create a reference curve that can be reused for multiple measurements. By copying the reference characteristics and using them for comparison, the system eliminates repeated calibration time while maintaining accurate strength measurement capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the testing process, eliminates the need for additional sensors, and enables the evaluation of pressure sensors' linearity, sensitivity, and mechanical integrity, allowing for the qualification of microelectromechanical semiconductor components across various thicknesses and pressure ranges.
Implementation Method 1
a deflection plunger (32) which can be advanced in a distance-controlled manner... the deflection plunger is brought into contact with the measuring element (18) and is subsequently advanced in a distance-controlled manner with reversible deformation of the measuring element
Implementation Method 2
the circuit elements comprise such elements which detect the mechanical stresses occurring during deformation of the measuring elements. These circuit elements are pressure-sensitive transistors or resistors, for example, which are integrated in the measuring element and are arranged in a bridge circuit
Data Source
AI summary
Methods are directed to checking a pressure sensor comprising a reversibly deformable, in particular reversibly bendable measuring element which supplies a measurement signal having a value depending on the degree of deformation of said measuring element, to the effect of whether the pressure sensor withstands a required maximum pressure which is larger by a predeterminable factor than a nominal pressure for which the sensor is designed. The methods generally involve use of a reference pressure sensor, which is structurally identical to the pressure sensor to be checked, for generating a distance/pressure characteristic curve and for evaluating the critical pressure required for breaking the measuring element. The critical pressure can then be used to determine if a particular value of pressure is larger than the required maximum pressure that the pressure sensor to be checked is intended to withstand.