MEMS Package Pressure Adjustment to Prevent Stiction

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Solution Overview

Problem

The fixed working pressure in MEMS packages may not meet different application requirements, leading to weakened damping effects and potential stiction issues that reduce the reliability and cause damage to the MEMS devices.

Innovation Solution

Incorporation of pressure adjustment elements and heating elements within the MEMS package to alter the working pressure by releasing gas molecules, allowing for adjustable vacuum levels to prevent stiction and improve device performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a fixed working pressure is used in MEMS packages, then the manufacturing process is simple, but the damping effect is weakened and stiction issues occur reducing reliability

Engineering Contradiction:
ImproveMEMS device reliabilityVSAvoidpressure control structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent changes the working pressure parameter from a fixed value to an adjustable range. By incorporating pressure adjustment elements and heating elements, the system can modify the vacuum level within the package to optimize damping effects and prevent stiction, thereby improving reliability without requiring complex external pressure control systems

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The heating element is integrated directly into the MEMS package structure, allowing the device to self-regulate its internal pressure environment. The heating element releases gas molecules from outgassing materials in a controlled manner, enabling the package to maintain optimal vacuum conditions autonomously without external intervention

Inventive Principle:
Principle #25Self-service

2Strength

If the vacuum level is not adjusted, then the device structure remains simple, but stiction occurs causing damage to MEMS devices

Engineering Contradiction:
ImproveMEMS device durabilityVSAvoidpressure adjustment mechanism
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent incorporates outgassing materials and heating elements during the manufacturing process, preparing the pressure adjustment mechanism in advance. The heating element is pre-positioned to release gas molecules at specific temperatures, creating optimal vacuum conditions before the device is put into operation, thus preventing stiction and enhancing durability

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent utilizes outgassing materials with controlled porosity that can store and release gas molecules. These porous materials are integrated into the package structure, allowing controlled release of gas when heated, thereby adjusting the internal vacuum level to prevent stiction without requiring complex mechanical adjustment mechanisms

Inventive Principle:
Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The adjustable pressure control enhances the reliability and performance of MEMS devices by reducing stiction and enabling them to operate within optimal vacuum conditions.

Implementation Method 1

heating elements...configured to provide heat to the pressure adjustment element. The pressure adjustment element may be heated by the heating elements through a heating operation

Methodology Applied
Scientific EffectThermal energy release of gas molecules: Heating

Implementation Method 2

The pressure adjustment element may be configured to increase the working pressure by releasing gases into the working region. The pressure adjustment element may be heated...in order to increase a working pressure

Methodology Applied
Scientific EffectThermal expansion and gas release: Thermal Expansion

Data Source

PatentUS12479719B2MEMS structure
Publication Date: 2025.11.25 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US12479719B2 patent drawing
  • US12479719B2 patent drawing
  • US12479719B2 patent drawing

AI summary

A MEMS package is provided. The MEMS package includes a metallization layer, a planarization structure, a MEMS device structure, a cap structure and a pressure adjustment element. The planarization structure has an inner sidewall defining a first cavity exposing the metallization layer. The MEMS device structure is bonded to the planarization structure. The MEMS device structure includes a movable element over the first cavity. The cap structure is bonded to the MEMS device structure and has an inner sidewall defining a second cavity facing the movable element. The pressure adjustment element is disposed in the second cavity.