MEMS Enclosed Spaces with Pressure-Tuning Layers
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Solution Overview
Problem
The semiconductor industry faces challenges in manufacturing micro-electro mechanical system (MEMS) devices due to increasing complexity and the need for advanced processing techniques that can efficiently form mechanical and electrical features with precise control over dimensions and materials.
Innovation Solution
The method involves forming a MEMS device by depositing and patterning dielectric and conductive layers on a semiconductor substrate, followed by bonding with a cap substrate to create enclosed spaces with pressure-changing layers that can adjust internal pressures, allowing for the formation of movable elements suitable for applications like accelerometers and gyroscopes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If advanced processing techniques are used to form smaller and more complex mechanical and electrical features, then device functionality and application versatility are improved, but fabrication complexity and manufacturing difficulty increase
Solution Approach 1:
The device is divided into multiple enclosed spaces (first enclosed space, second enclosed space) with distinct pressure environments. Each enclosed space contains specific movable elements (first movable element, second movable element) that can be independently configured and optimized for different applications, allowing the device to perform multiple functions while maintaining manageable fabrication processes for each segment.
Solution Approach 2:
Different enclosed spaces are assigned different pressure characteristics (first pressure, second pressure) to optimize performance for specific applications. The pressure-changing layer is selectively positioned to control pressure in specific regions, allowing local optimization of device characteristics without requiring complete redesign of the entire structure.
2Adaptability or versatility
If multiple enclosed spaces with different pressures are created to optimize device performance, then application versatility is improved, but manufacturing steps and fabrication time increase
Solution Approach 1:
The pressure-changing layer is incorporated into the device structure during the fabrication process itself, before final assembly and sealing of the enclosed spaces. This preliminary action allows pressure control functionality to be built-in during manufacturing rather than requiring post-fabrication processing, reducing overall fabrication time while enabling multiple pressure environments.
Solution Approach 2:
The pressure-changing layer serves multiple functions: it controls pressure in different enclosed spaces, enables diverse applications (accelerometers, gyroscopes, etc.), and can be integrated with other device components. This multi-functionality reduces the need for separate components and processing steps, thereby reducing fabrication time while maintaining application versatility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of MEMS devices with precise mechanical and electrical features, allowing for efficient manufacturing and tuning of internal pressures to suit various applications, reducing fabrication costs and time while maintaining precise control over device performance.
Implementation Method 1
The pressure in the first enclosed space may be changed after the first enclosed space is formed. The pressure in the first enclosed space may be changed by outgassing or by a gas getter layer in the first enclosed space.
Implementation Method 2
The pressure in the first enclosed space may be changed by outgassing or by a gas getter layer in the first enclosed space.
Data Source
AI summary
A structure and a formation method of a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a cap substrate and a MEMS substrate bonded with the cap substrate. The MEMS substrate includes a first movable element and a second movable element. The MEMS device also includes a first enclosed space surrounded by the MEMS substrate and the cap substrate, and the first movable element is in the first enclosed space. The MEMS device further includes a second enclosed space surrounded by the MEMS substrate and the cap substrate, and the second movable element is in the second enclosed space. In addition, the MEMS device includes a pressure-changing layer in the first enclosed space.