MEMS Probe Card Submicron Manufacturing via Template Etching
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Solution Overview
Problem
Existing technologies are unable to effectively manufacture probe cards with submicron-sized probes due to the challenge of preventing probe bending during the manufacturing process, which leads to manufacturing failures.
Innovation Solution
A MEMS probe card manufacturing process involving a guide plate-MEMS probe structure template etching equipment and method, which includes a stiffener, PCB board, adapter layer, guide plate, and MEMS probe, allowing for precise positioning and etching to prevent probe bending and ensure submicron-sized probe accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the probe dimension is reduced to submicron level, then the measurement precision and testing capability are improved, but the probe becomes prone to bending during manufacturing
Solution Approach 1:
The patent applies preliminary action by pre-defining the probe structure within a template before the actual manufacturing process. The template includes guide plates and positioning structures that are prepared in advance to constrain the probe during fabrication, preventing bending before it can occur.
Solution Approach 2:
The patent introduces a template as an intermediary element between the manufacturing process and the final probe structure. This template includes guide plates and positioning features that mediate the fabrication process, ensuring submicron probes are formed without bending while maintaining manufacturing feasibility.
2Measurement precision
If the probe dimension is reduced to submicron level, then the testing capability for advanced chips is improved, but the manufacturing process becomes increasingly difficult
Solution Approach 1:
The patent uses a template as a copy or pattern that defines the probe structure. This template can be repeatedly used to manufacture multiple submicron probes with consistent precision, making the complex submicron fabrication process more manageable and reproducible.
Solution Approach 2:
By preparing the template with guide plates and positioning structures in advance, the patent simplifies the actual probe fabrication process. The preliminary template work enables submicron precision to be achieved more easily during the manufacturing stage.
3Ease of manufacture
If conventional probe card manufacturing methods are used, then the manufacturing process is simple, but submicron-sized probes cannot be produced without bending
Solution Approach 1:
The patent segments the manufacturing process into template preparation and probe fabrication stages. The template includes separate guide plates and positioning structures that can be independently designed and manufactured, then combined to achieve the final submicron probe structure with high precision.
Solution Approach 2:
The template serves as an intermediary that bridges conventional manufacturing methods with submicron precision requirements. It incorporates guide plates and positioning features that enable standard manufacturing processes to produce submicron probes without bending.
Data Source
AI summary
The MEMS probe card of the invention belongs to the technical field of IC manufacturing industry, and specifically relates to the manufacturing of micro-electromechanical systems, testing of semiconductor bare chip and related key technologies; From top to bottom, the probe card comprises a stiffener, a PCB board, an adapter layer, a guide plate and a MEMS probe; the invention not only discloses a MEMS probe card, but also discloses a new manufacturing process of a MEMS probe card, including the structure of MEMS probe card, the etching equipment and method of guide plate-MEMS probe structure template, the probe positioning method of etching the guide plate-MEMS probe structure template, the manufacturing method of the guide plate-MEMS probe structure and the docking device and method of the guide plate-MEMS probe structure and the adapter layer to finally realize the manufacturing of a submicron-sized MEMS probe card.