MEMS Probe Laser Etching With Continuous Spacing Adjustment
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Solution Overview
Problem
Current methods for manufacturing MEMS probes, such as bottom-up electroplating and top-down lithography, face challenges including environmental concerns, precision control issues, and high production costs, especially as probe sizes decrease and complexity increases, with no existing universal laser etching equipment capable of achieving high accuracy and continuous spacing adjustment.
Innovation Solution
A MEMS probe laser etching device comprising an arc light source, spiral through-groove plate, straight through-groove plate, objective lens, and four-dimensional stage, allowing for precise etching with continuous adjustment of spacing through a pinhole structure and optical focusing method, enabling high accuracy and flexibility in etching micron-sized or sub-micron-sized probes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If bottom-up electroplating method is used to manufacture probes, then production cost is reduced and processing is simplified, but manufacturing precision deteriorates and environmental harm increases
Solution Approach 1:
The patent replaces the chemical electroplating system with a laser-based physical system. The laser etching device uses optical energy to directly etch probes with high precision, eliminating the need for chemical baths, masks, and multiple plating steps while achieving sub-micron accuracy through controlled laser ablation.
Solution Approach 2:
The patent changes the fundamental processing parameter from chemical deposition (electroplating) to optical ablation (laser etching). By controlling laser power, pulse duration, and scanning speed, the system achieves precise depth and width control of probe structures without the precision limitations of electroplating.
2Manufacturing precision
If top-down lithography method is used to manufacture smaller probes, then manufacturing precision is improved, but production cost increases exponentially
Solution Approach 1:
The patent replaces the complex lithography system with a direct laser writing system. Instead of requiring photoresist coating, pattern exposure, and development steps, the laser system directly writes probe patterns through controlled ablation, significantly simplifying the manufacturing process while maintaining high precision.
Solution Approach 2:
The patent extracts the essential function of probe pattern formation from the complex lithography process. By using laser direct writing, it removes the need for photoresist materials, alignment systems, and multiple processing steps, keeping only the critical pattern formation function.
3Manufacturing precision
If top-down lithography method is used to manufacture smaller probes, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent extracts the essential function of probe pattern formation from the complex lithography process. By using laser direct writing, it removes the need for photoresist materials, alignment systems, and multiple processing steps, keeping only the critical pattern formation function.
Solution Approach 2:
The laser etching device is designed with multi-functionality to handle various probe sizes and patterns using a single system. The adjustable laser parameters and programmable motion control allow the same device to produce different probe geometries without requiring multiple specialized tools.
4Productivity
If probe size is reduced to micron or sub-micron scale, then testing capabilities are improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent uses precise control of laser parameters (power, pulse width, repetition rate, scanning speed) to achieve the required sub-micron precision for small probe sizes. By optimizing these parameters, the system can etch features at the 1 micrometer scale and below with high accuracy.
Solution Approach 2:
The patent employs pulsed laser operation with controlled repetition rates to achieve precise etching of small features. The periodic pulsing allows heat accumulation control and prevents excessive melting or recasting, enabling high precision at micron and sub-micron scales.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides high etching accuracy, dynamic adjustment of etching spacing, and reduced production costs by avoiding environmental issues associated with electroplating and high costs of top-down lithography, while ensuring precise vertical etching and flexible adjustment of etching speed and accuracy.
Implementation Method 1
a laser etching method for MEMS probes
Data Source
AI summary
A laser etching method for MEMS probes belongs to the technical field of semiconductor processing and testing; first, the MEMS probe laser etching method performs the parameter calculation to obtain the step angle of the motor according to the etching spacing of the single crystal silicon wafer; then it performs the initial position adjustment to rotate the spiral through-groove plate to the initial position and move the first etching point to the optical axis, and adjust the four-dimensional stage; and then it performs the laser etching and progress judgment; and finally adjusts the four-dimensional stage and the motor, including the downward movement distance, left movement distance and clockwise rotation angle of the four-dimensional stage and the rotation angle of the motor; the MEMS probe laser etching method, combined with the MEMS probe laser etching device, not only has higher etching accuracy, but also continuously adjusts the etching spacing.