MEMS Probe Card Repair via Voltage-Activated Release Layer
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Solution Overview
Problem
Current methods for repairing microelectromechanical systems (MEMS) probe cards are inefficient, costly, and can damage other probes, leading to variations in performance due to separate manufacturing processes for operational and replacement probes.
Innovation Solution
A novel method and device for repairing MEMS probe cards using a substrate with operational and replacement probes constructed in the same manufacturing process, featuring a release layer activated by voltage for easy removal and installation of damaged probes, allowing for efficient and accurate repair.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional separate manufacturing processes are used for operational and replacement probes, then replacement probes can be produced, but performance variations occur due to tolerance differences
Solution Approach 1:
The patent merges the manufacturing process for operational probes and replacement probes into a single integrated process. Both types of probes are fabricated simultaneously on the same substrate using identical steps, ensuring they share the same tolerance characteristics and material properties, thereby eliminating performance variations between operational and replacement probes.
Solution Approach 2:
The patent incorporates replacement probes during the initial manufacturing process before the probe card is put into service. By preparing replacement probes in advance using the same manufacturing process, the system ensures that replacements are already matched in tolerance and performance characteristics, eliminating the need for separate post-manufacturing production.
2Ease of repair
If damaged probes are removed using conventional techniques, then repair can proceed, but other probes may be damaged in the process
Solution Approach 1:
The patent segments the probe structure by providing individual electrical connections for each probe to the substrate. This segmentation allows selective removal of only the damaged probe through its own connection path without affecting other probes, as each probe is electrically and physically isolated at the connection level.
Solution Approach 2:
The patent extracts the damaged probe from the probe card through its individual electrical connection to the substrate, allowing selective removal without disturbing other probes. The extraction process targets only the specific damaged component while leaving the rest of the system intact.
3Ease of repair
If new probes are constructed after probe card assembly, then replacement is possible, but repair time and cost increase significantly
Solution Approach 1:
The patent prepares replacement probes in advance during the initial manufacturing process, before the probe card is assembled and put into service. These pre-fabricated replacement probes are integrated into the probe card structure, allowing immediate replacement of damaged probes without the need for time-consuming post-assembly construction.
Solution Approach 2:
The patent combines the production of operational and replacement probes into a single manufacturing cycle. By producing both types of probes simultaneously using the same process, the system eliminates the time delay associated with constructing replacement probes separately after assembly, enabling rapid repair operations.
4Adaptability or versatility
If separate manufacturing processes are used for replacement probes, then replacement can be made, but material properties and tolerances vary
Solution Approach 1:
The patent merges the manufacturing processes for operational and replacement probes into a single integrated process. Both types of probes are fabricated simultaneously on the same substrate using identical materials and process parameters, ensuring that material properties and tolerances remain consistent across all probes regardless of their intended function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces repair time and cost by ensuring identical tolerances and material properties between operational and replacement probes, minimizing performance variations and inefficiencies, and enabling quick replacement without disrupting production.
Implementation Method 1
a release layer activated by voltage for easy removal and installation of damaged probes
Data Source
AI summary
A method for repairing a damaged probe from a probe card comprising the steps of removing the damaged probe from the probe card, separating one a plurality of replacement probes from a substrate and installing the one probe separated from the plurality of replacement probes where the damaged probe was removed.