MEMS Sealing via Recessed Dielectric and Packaging Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing MEMS devices face challenges in achieving good sealing quality, leading to long processing times and complex manufacturing processes, particularly when requiring a sealed chamber for applications like pressure sensors.
Innovation Solution
A recess structure in the dielectric layer and a corresponding opening in the structure layer allow for continuous and uniform filling of the packaging layer, preventing sealing seams and hollow structures, thus improving sealing quality and stability without requiring complicated processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional sealing methods are used to create a sealed chamber in MEMS devices, then sealing quality is achieved, but processing time increases and manufacturing process becomes complicated
Solution Approach 1:
The sealing structure is divided into two functional parts: a recess structure formed in the dielectric layer and a packaging layer filled into the recess. This segmentation allows each part to be optimized independently - the recess provides the sealing cavity while the packaging layer provides the sealing material, resolving the contradiction between achieving good sealing quality and simplifying the manufacturing process
Solution Approach 2:
The recess structure is pre-formed in the dielectric layer before the packaging layer is applied. This preliminary action creates a ready-to-fill cavity that guides the packaging layer material to flow in uniformly, ensuring complete sealing without requiring complex subsequent processing steps, thus reducing processing time while maintaining sealing quality
2Reliability
If conventional sealing methods are used to create a sealed chamber in MEMS devices, then sealing quality is achieved, but manufacturing process complexity increases
Solution Approach 1:
The sealing process is segmented into distinct steps: forming the recess structure in the dielectric layer, then filling the packaging layer material into the recess. This segmentation simplifies the manufacturing process by breaking down the complex sealing operation into manageable, standardized steps that can be performed with conventional equipment and processes
Solution Approach 2:
The invention changes the geometric parameters of the sealing structure by creating a recess with specific dimensions and shape in the dielectric layer. This parameter change allows the packaging layer to be filled uniformly and completely, achieving high sealing quality through controlled geometry rather than complex processing procedures
3Reliability
If packaging layer is filled into sealing structures, then sealing quality improves, but hollow structures and sealing seams may form reducing stability
Solution Approach 1:
The recess structure is pre-formed with optimized geometry before the packaging layer is applied. The recess acts as a mold that guides the packaging layer material to fill uniformly and completely, preventing the formation of hollow structures and sealing seams. This preliminary geometric preparation ensures both complete filling and structural stability
Solution Approach 2:
The invention optimizes the geometric parameters of the recess structure, including its depth, width, and sidewall angle, to ensure complete and uniform filling by the packaging layer material. By carefully controlling these parameters, the recess structure prevents void formation and ensures homogeneous material distribution, thereby improving both sealing quality and structural stability
Data Source
AI summary
A MEMS device is provided. The MEMS device includes a substrate having at least one contact, a first dielectric layer disposed on the substrate, at least one metal layer disposed on the first dielectric layer, a second dielectric layer disposed on the first dielectric layer and the metal layer and having a recess structure, and a structure layer disposed on the second dielectric layer and having an opening. The opening is disposed to correspond to the recess structure, and the cross-sectional area at the bottom of the opening is smaller than the cross-sectional area at the top of the recess structure. The MEMS device also includes a packaging layer, and at least a portion of the packaging layer is disposed in the opening and the recess structure. The second dielectric layer, the structure layer, and the packaging layer define a chamber.