Composite MEMS Resonator Structure for Low Temperature Drift

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Microelectromechanical (MEMS) devices face challenges in maintaining frequency stability due to temperature sensitivity, particularly in silicon-based oscillators, where the oscillation frequency varies with Young's modulus, leading to reliability and performance issues, especially with the use of polysilicon structures and silicon oxide coatings which introduce variability and stiction problems.

Innovation Solution

A microelectromechanical device is designed using a composite material with a silicon oxide core and a polycrystalline silicon coating, where the dimensional ratios between the core and coating layers are optimized to minimize temperature-dependent frequency variations, ensuring high stability and reliability by maintaining mechanical characteristics similar to pure silicon while avoiding the drawbacks of silicon oxide coatings.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a silicon oxide coating is applied to a silicon core to compensate temperature sensitivity, then frequency stability is improved, but geometric variability and stiction problems are introduced

Engineering Contradiction:
Improvefrequency stabilityVSAvoidgeometric variability
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent uses a composite structure consisting of a silicon core and a silicon oxide coating layer. The silicon core provides mechanical strength and defines the primary geometry, while the silicon oxide coating compensates for temperature sensitivity. This composite approach allows the device to achieve frequency stability without suffering from the geometric variability issues that would result from using silicon oxide as the primary structural material.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The silicon oxide coating is applied only as a thin surface layer on the silicon core, rather than using silicon oxide throughout the entire structure. This localized application provides the temperature compensation benefits where needed (at the surface) while maintaining the geometric precision and mechanical properties of the silicon core in the bulk structure.

Inventive Principle:
Principle #3Local quality

2Reliability

If high doping levels are used to change crystalline structure and elastic properties, then frequency stability is improved, but the solution cannot be used with polysilicon structures

Engineering Contradiction:
Improvefrequency stabilityVSAvoidmaterial compatibility
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent changes the physical and chemical parameters of the silicon material through controlled oxidation, transforming the surface silicon into silicon oxide. This parameter change allows the material to exhibit different elastic properties and temperature coefficients at the surface level, achieving frequency stability without requiring high doping levels that would be incompatible with polysilicon structures.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides MEMS devices with improved frequency stability and reliability, maintaining high impact resistance and predictable performance by minimizing temperature-dependent frequency variations and avoiding geometric variability issues associated with silicon oxide coatings.

Implementation Method 1

the dependency of frequency on temperature may be compensated by using a composite material, comprising a plurality of materials with different and opposite temperature coefficients, proposing a material comprising a silicon core and a silicon oxide coating

Methodology Applied
Scientific EffectTemperature coefficient compensation: Thermal Expansion

Implementation Method 2

A first insulating layer, which for example is made of silicon oxide, is thermally grown on a substrate... A conductive layer, which for example is made of polycrystalline silicon, is deposited on the first insulating layer

Methodology Applied
Scientific EffectChemical vapor deposition: Chemical Vapour Deposition

Implementation Method 3

the oscillation beams 16, 19 vibrate along the direction Y at their oscillation frequency, and the distance between same and the detection electrode 13 varies periodically

Methodology Applied
Scientific EffectMechanical vibration: Vibration

Implementation Method 4

the drive and detection electrodes 11, 13 are capacitively coupled to a mobile structure 20... the drive electrodes 11 are biased by an alternating drive voltage VAC

Methodology Applied
Scientific EffectElectrostatic force: Electrostatics

Data Source

PatentUS10771042B2Micro-electro-mechanical device with reduced temperature sensitivity and manufacturing method thereof
Publication Date: 2020.09.08 STMICROELECTRONICS SRL
  • US10771042B2 patent drawing
  • US10771042B2 patent drawing
  • US10771042B2 patent drawing

AI summary

A microelectromechanical device having a mobile structure including mobile arms formed from a composite material and having a fixed structure including fixed arms capacitively coupled to the mobile arms. The composite material includes core regions of insulating material and a silicon coating.