MEMS Rotation Sensor with Integrated Electronics and Bulk Micromachining

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Solution Overview

Problem

Existing rotational accelerometers face limitations in sensitivity and noise susceptibility due to parasitic capacitances and stiction issues in surface micromachining, and lack integration with detection electronics, which affects their performance in measuring rotational accelerations.

Innovation Solution

The development of rotational sensors using bulk micromachining methods with integrated electronics, featuring proof masses anchored via flexures and transducers that sense rotation relative to a sense substrate, reducing parasitic capacitances and noise through a full bridge measurement configuration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If surface micromachining is used to fabricate proof masses, then the device can be manufactured with standard processes, but the proof mass thickness is limited to deposited film thickness and stiction problems occur requiring additional perimeter supports

Engineering Contradiction:
ImprovemanufacturabilityVSAvoiddevice complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent uses bulk micromachining to create proof masses that are released through sacrificial layer etching, creating a copy of the desired structure without the limitations of surface micromachining film thickness. This allows thicker proof masses to be fabricated while maintaining compatibility with standard semiconductor manufacturing processes.

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The patent changes the fabrication approach from surface micromachining to bulk micromachining, fundamentally altering the manufacturing parameter space. This enables proof masses with thicknesses greater than deposited films and eliminates stiction issues inherent to surface micromachining release processes.

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If detection electronics are connected through wire bonding, then the system can be assembled, but parasitic capacitances increase and the system becomes susceptible to noise and coupling of unwanted signals

Engineering Contradiction:
Improveassembly capabilityVSAvoidsignal quality
Core Design Contradiction:
Ease of manufactureVSMeasurement precision

Solution Approach 1:

The patent integrates the detection electronics directly with the MEMS structure, merging the sensing element and readout circuitry into a single monolithic device. This eliminates wire bonds and associated parasitic capacitances, thereby improving signal quality and reducing noise susceptibility.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent uses an intermediate sacrificial layer that is etched away to release the proof mass while simultaneously providing release paths for electrical connections. This intermediary structure enables direct electrical access to the proof mass without requiring wire bonds, thus eliminating parasitic capacitances.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Stability of the object's composition

If additional perimeter supports are added to reduce stiction, then stability increases, but the device becomes more complicated and requires stringent fabrication of additional springs

Engineering Contradiction:
ImprovestabilityVSAvoiddevice complexity
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The patent extracts and removes the problematic perimeter supports that were previously necessary in surface micromachined devices. By using bulk micromachining with sacrificial layer release, the proof mass is freed from stiction issues, eliminating the need for additional stabilizing structures and reducing device complexity.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances sensitivity and reduces noise susceptibility, enabling accurate measurement of rotational accelerations while being insensitive to linear accelerations, and allows for compact, hermetically sealed sensors with improved dynamic response and noise performance.

Implementation Method 1

Capacitive sensors provide high performance as well as low cost. Because of these features it became the method of choice for most of the consumer market applications.

Methodology Applied
Scientific EffectCapacitive sensing: Capacitance

Implementation Method 2

Each of the at least two proof masses is anchored to the sense substrate via at least one flexure

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS9846175B2MEMS rotation sensor with integrated electronics
Publication Date: 2017.12.19 INVENSENSE INC
  • US9846175B2 patent drawing
  • US9846175B2 patent drawing
  • US9846175B2 patent drawing

AI summary

A rotational sensor for measuring rotational acceleration is disclosed. The rotational sensor comprises a sense substrate; at least two proof masses, and a set of two transducers. Each of the at least two proof masses is anchored to the sense substrate via at least one flexure and electrically isolated from each other; and the at least two proof masses are capable of rotating in-plane about a Z-axis relative to the sense substrate, wherein the Z-axis is normal to the substrate. Each of the transducers can sense rotation of each proof mass with respect to the sense substrate in response to a rotation of the rotational sensor.