MEMS Device Sealing Component for Small Molecule Barrier
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Solution Overview
Problem
MEMS devices are vulnerable to external small molecular substances penetrating the bonding layer and adhering to internal components, affecting performance and reducing service life.
Innovation Solution
A MEMS device design incorporating a sealing component with multiple layers and irregular protrusions/depressions to prevent external small molecules from entering the cavity structure, ensuring tight contact between packaging layers and substrates to isolate the MEMS component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a bonding layer is used to package the MEMS device, then the device can be protected and assembled, but external small molecular substances can penetrate the bonding layer and adhere to internal components
Solution Approach 1:
The bonding layer is divided into multiple sub-layers (first bonding layer and second bonding layer) with different materials and functions. The first bonding layer provides mechanical bonding, while the second bonding layer provides hermetic sealing to prevent small molecular substance penetration. This segmentation allows each layer to specialize in preventing specific failure modes.
Solution Approach 2:
The patent uses composite material structure with at least two different materials in the bonding layer. The first material provides mechanical strength and bonding, while the second material provides hermetic sealing properties to block small molecular substances. This composite approach combines the advantages of different materials to simultaneously achieve mechanical integrity and chemical barrier properties.
2Ease of manufacture
If the packaging layers are made flat and simple, then the manufacturing process is easier, but the contact between packaging layers and substrates is not tight enough
Solution Approach 1:
The packaging layers incorporate irregular protrusions and depressions (curved/irregular surfaces) instead of flat surfaces. These irregularities increase the contact area and mechanical interlocking between layers, ensuring tight contact and hermetic sealing while maintaining compatibility with standard semiconductor manufacturing processes.
3Device complexity
If a single-layer bonding structure is used, then the device structure is simpler, but small molecular substances can penetrate through the bonding layer
Solution Approach 1:
The bonding layer is segmented into multiple sub-layers with distinct functions. The first bonding layer handles mechanical attachment, while the second bonding layer provides hermetic sealing. This functional segmentation prevents small molecular substance penetration without requiring excessive structural complexity.
Solution Approach 2:
Different regions of the bonding structure have different properties optimized for their specific functions. The first bonding layer region is optimized for mechanical strength, while the second bonding layer region is optimized for hermetic sealing. This local quality differentiation allows effective prevention of substance penetration with minimal overall complexity.
Data Source
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AI summary
A Micro-Electro-Mechanical System (MEMS) device is provided. The device includes a substrate, a packaging component provided on the substrate and a MEMS component provided inside the packaging component and on the substrate. The device further includes a sealing component. Herein, the sealing component is provided on the substrate and/or the packaging component, for preventing an external small molecule from contacting with the MEMS component. A fabrication method of the MEMS device is further provided.