MEMS Sensor Packaging with Barrier Element
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Solution Overview
Problem
The existing manufacturing processes for electronic devices with MEMS sensors require costly and complex steps, particularly the formation of a cover or cap that increases costs and complicates the assembly of MEMS devices on LGA or BGA substrates.
Innovation Solution
The solution involves a protective package realized through molding that exposes the sensitive portion of the MEMS device and substrate, with a barrier element positioned around the sensitive area to prevent damage during the molding process, allowing for a simpler and more cost-effective assembly method.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cover or cap is formed to encapsulate the MEMS device and substrate, then the MEMS device is protected from external physical stresses, but the manufacturing process becomes more complex and costly
Solution Approach 1:
The patent merges the protective cover function with the substrate structure by forming the cover as an integral part of the substrate through semiconductor manufacturing processes. This eliminates the need for separate cover formation steps and reduces overall device complexity while maintaining protection functionality.
Solution Approach 2:
The patent replaces traditional mechanical assembly processes (separate cover attachment) with semiconductor manufacturing processes (molding, encapsulation). This substitution enables the protective structure to be formed integrally with the substrate using conventional IC fabrication techniques, reducing manufacturing complexity.
2Reliability
If a cover or cap is formed to encapsulate the MEMS device, then the MEMS device is protected, but additional process steps are required which increase manufacturing cost
Solution Approach 1:
The protective cover is merged with the substrate formation process, allowing both structures to be created in the same manufacturing sequence. This integration eliminates additional process steps and reduces manufacturing cost while ensuring the MEMS device remains protected.
Solution Approach 2:
The substrate structure is designed to serve multiple functions: it provides electrical connections, mechanical support, and protective encapsulation. This multi-functionality eliminates the need for separate protective components and reduces overall manufacturing cost.
3Adaptability or versatility
If the sensitive portion of the MEMS device is exposed for fluid interaction, then the sensor can detect chemical/physical variations, but the sensitive portion is vulnerable to damage during molding
Solution Approach 1:
The patent applies a protective coating to the sensitive portion of the MEMS device before the molding process. This preliminary protective action prevents damage during subsequent manufacturing steps while allowing the sensor to maintain its functionality for detecting chemical and physical variations.
Solution Approach 2:
The patent uses thin film protective coatings on the sensitive MEMS structures. These films provide mechanical protection during molding and handling while remaining thin enough to allow the sensor to interact with and detect variations in the surrounding fluid environment.
Data Source
AI summary
An electronic device includes a substrate provided with a passing opening and a MEMS device including an active surface wherein a portion of the MEMS device is integrated sensitive to chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the opening. A protective package incorporates at least partially the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device, and the opening of the substrate exposed. A barrier element is positioned in an area which surrounds the sensitive portion to realize a protection structure for the MEMS device, so that the sensitive portion is free.