MEMS Sensor Chip Axial Separation via Symmetric Piezoresistive Arrangement
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Solution Overview
Problem
Conventional MEMS force sensor devices experience increased errors and reduced accuracy when handling composite inputs across multiple axes due to insufficient axial separation properties.
Innovation Solution
The sensor chip is designed with a specific arrangement of piezoresistive elements and detecting beams that enhance axial separation and accuracy by distributing piezoresistive elements symmetrically across the chip, allowing for precise detection of forces and moments across six axes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a force sensor device is constructed by connecting multiple sensor chips using a transfer chip, then the device can be manufactured with high precision and reliability, but the device complexity and manufacturing process difficulty increase
Solution Approach 1:
The patent merges the transfer chip functionality directly into the sensor chip structure by forming convex portions that protrude from the sensor chip body. This integration eliminates the need for separate transfer chips and complex multi-chip assembly processes, while maintaining the precision benefits of the transfer chip approach.
Solution Approach 2:
The patent implements a nested structure where convex portions on sensor chips fit into corresponding concave portions on the substrate, creating a hierarchical assembly structure. This nesting approach enables precise positioning and connection of multiple sensor chips to the substrate without requiring complex external alignment mechanisms.
2Reliability
If convex portions are formed on sensor chips to connect with concave portions on the substrate, then connection reliability is improved, but the sensor chip manufacturing complexity increases
Solution Approach 1:
The patent applies local quality by forming convex portions only at specific connection regions of the sensor chip, rather than modifying the entire chip structure. This localized modification approach maintains connection reliability while minimizing the impact on overall sensor chip manufacturing processes and structural complexity.
3Measurement precision
If multiple sensor chips are connected to a substrate using a transfer chip, then measurement precision is improved, but the manufacturing cost and process time increase
Solution Approach 1:
The patent implements preliminary action by pre-forming the convex portions on sensor chips during the sensor chip manufacturing process itself, rather than adding them later during assembly. This preliminary formation of connection structures enables direct mounting of sensor chips to the substrate, eliminating time-consuming post-manufacturing steps and improving overall manufacturing efficiency.
4Device complexity
If sensor chips are directly mounted on the substrate without a transfer chip, then device complexity is reduced, but manufacturing precision may be compromised
Solution Approach 1:
The patent solves the positioning precision problem by transitioning from a planar connection interface to a three-dimensional interface using convex and concave portions. This dimensional change enables precise positioning in multiple directions (vertical alignment through the convex-concave fit, and horizontal positioning through the geometric constraints), achieving high positioning precision without requiring complex transfer chip mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the axial separation property and sensor accuracy for composite inputs, ensuring accurate detection of forces and moments even when multiple axes are simultaneously inputted.
Implementation Method 1
a plurality of piezoresistive elements... capable of detecting strain
Data Source
Figure 1(a)~1(b)
Figure 2
Figure 3(a)~3(b)
AI summary
A sensor chip includes a substrate, first supporting portions, a second supporting portion around which the first support portions are disposed, the second supporting portion being disposed at a center of the substrate, first detecting beams each connecting the first supporting portions, which are mutually adjacent, second detecting beams disposed in parallel with the first detecting beams between the first detecting beams and the second supporting portion, force points disposed in the first detecting beams so as to be applied with force, and a plurality of strain detecting elements disposed a predetermined positions of the first detecting beams and the second detecting beams, wherein the plurality of strain detecting elements includes a first detecting portion having a strain detecting element capable of detecting force in a first direction, and a second detecting portion having a strain detecting element disposed at a position symmetric relative to the first detecting portion.