MEMS Sensor Folded Wiring Structure for Stress Isolation
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Solution Overview
Problem
Existing sensors with MEMS structures face challenges in improving their detection characteristics, particularly in maintaining stability and accuracy under stress and manufacturing variations.
Innovation Solution
The sensor design incorporates a unique wiring structure with a folded configuration, where the first wiring portion includes multiple interconnected portions that allow for flexibility and reduced stress, thereby minimizing unintended displacement of the movable portion and enhancing detection accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a conventional wiring structure is used in MEMS sensors, then the structure is simple and easy to manufacture, but the wiring experiences stress that causes unintended displacement of the movable portion, reducing detection accuracy
Solution Approach 1:
The wiring structure is divided into multiple segments including a first wiring portion, a second wiring portion, and a third wiring portion. Each segment serves a specific function: the first wiring portion is fixed to the substrate, the second wiring portion connects to the movable portion, and the third wiring portion bridges between them. This segmentation allows stress isolation, preventing stress from affecting the movable portion while maintaining structural integrity and detection accuracy.
2Stability of the object's composition
If the wiring is made flexible to reduce stress, then unintended displacement is reduced, but the wiring structure becomes more complex
Solution Approach 1:
The wiring structure incorporates dynamic characteristics through its multi-portion design. The third wiring portion acts as a flexible bridge that can dynamically adjust to stress variations without transmitting them to the movable portion. This dynamic structure maintains structural stability by absorbing mechanical stress while keeping the overall configuration manageable through functional zoning.
3Measurement precision
If a multi-portion wiring structure is implemented, then stress management is improved and detection accuracy increases, but the manufacturing process becomes more difficult
Solution Approach 1:
The multi-portion wiring structure is merged into a single continuous conductive layer formed through one integrated thin-film deposition process. This combining approach maintains detection accuracy by preserving the functional benefits of multiple wiring portions while simplifying manufacturing by eliminating the need for separate fabrication steps for each portion, thus improving ease of manufacture.
Data Source
AI summary
According to one embodiment, a sensor includes a base, a fixed portion fixed to the base, and an element portion. The fixed portion includes a first wiring fixed portion and a first fixed portion. The element portion includes a first wiring portion supported by the first wiring fixed portion and including a first wiring, a first support member supported by the first fixed portion, a first intermediate member connected to the first wiring portion and the first support member, and a movable portion connected to the first intermediate member. The movable portion includes a first movable conductive layer electrically connected to the first wiring. A first gap is provided between the base and the element portion. A second direction from the first wiring fixed portion to the first intermediate member crosses a first direction from the base to the first wiring fixed portion.