MEMS Sensor Heater for Temperature Offset Compensation
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Solution Overview
Problem
Electronic sensors face performance degradation due to exposure to external environments, such as water and varying temperatures, with existing calibration algorithms failing to address temperature coefficient offsets after soldering on a board.
Innovation Solution
Integration of a heater element within the sensor device to generate heat and calibrate the sensor post-soldering, addressing temperature coefficient offsets and removing liquid by evaporating water droplets on the deformable membrane.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If calibration algorithm is used before soldering the sensor, then performance degradation from water exposure is addressed, but temperature coefficient offset after soldering is not compensated
Solution Approach 1:
The heater element is integrated into the sensor device to enable preliminary heating and calibration actions before the sensor is soldered onto the board. This preliminary action allows the sensor to be calibrated at a controlled temperature, and the heater can subsequently compensate for temperature coefficient offsets after soldering by maintaining or adjusting the sensor temperature.
2Object-affected harmful factors
If sensor is exposed to water droplets on the membrane, then liquid contact is detected, but performance degradation and offset occur
Solution Approach 1:
The heater element, which generates thermal energy, is used to evaporate water droplets that contact the deformable membrane. By converting the harmful effect of liquid exposure into a beneficial drying action, the sensor performance is restored and liquid-induced offsets are eliminated without requiring separate detection and removal systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively stabilizes sensor performance by compensating for temperature-dependent shifts and removing liquid-induced offsets, ensuring consistent operation across different environmental conditions.
Implementation Method 1
heat is generated by ohmic heating as an electric current passes through at least part of one of the structural layers of the device
Implementation Method 2
removing liquid by evaporating water droplets on the deformable membrane
Data Source
Figure 1A
Figure 1B
Figure 2
AI summary
A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.