MEMS Sensor Package with Heat Transfer Pad for Thermal Contact
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Solution Overview
Problem
Existing internal temperature measuring apparatuses using MEMS chips face challenges in achieving thermal contact with measurement objects due to the MEMS chip's placement on printed wiring boards, leading to poor responsiveness and measurement accuracy.
Innovation Solution
The apparatus features a MEMS chip and temperature sensor housed in a bottomed tubular package with a heat transfer pad, projecting from a printed circuit board, allowing direct thermal contact with the measurement object and improving thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the MEMS chip is disposed on the printed wiring board, then the device structure is simple and easy to manufacture, but the thermal contact with the measurement object is poor leading to low responsiveness
Solution Approach 1:
The patent introduces a heat transfer pad as an intermediary component between the MEMS chip and the printed wiring board. This heat transfer pad serves as a thermal bridge that conducts heat from the measurement object through the package bottom to the MEMS chip, enabling effective thermal contact without requiring direct mechanical attachment of the chip to the body surface. The heat transfer pad resolves the contradiction by maintaining manufacturing simplicity while achieving the required thermal conductivity for responsive measurement.
2Reliability
If the heat insulator has high heat resistance and heat capacity, then the temperature measurement stability is improved, but the responsiveness of the sensor module deteriorates
Solution Approach 1:
The patent applies local quality by differentiating the thermal properties of different components: the heat transfer pad uses high thermal conductivity materials (such as metal or thermally conductive polymers) to rapidly transmit heat to the MEMS chip, while the package bottom can incorporate heat insulating layers to prevent heat loss to the surrounding environment. This localized differentiation of thermal properties allows the system to achieve both rapid response and measurement stability simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances thermal contact and measurement accuracy by ensuring the MEMS chip and measurement object are in close thermal contact, improving the responsiveness and reliability of core body temperature measurements.
Implementation Method 1
the MEMS chip comprising one or plural thermopiles each of which measures a heat flux passing through a region of a bottom of the bottomed tubular package
Implementation Method 2
a heat transfer pad provided at a bottom of the bottomed tubular package, the outer bottom face of the sensor package projecting from a plate face of the printed circuit board through a through-hole made in the printed circuit board
Data Source
AI summary
An internal temperature measuring apparatus includes: a sensor package in which a MEMS chip and a temperature sensor are disposed in a bottomed tubular package, the MEMS chip including one or a plurality of thermopiles each of which measures a heat flux passing through a region of a bottom of the bottomed tubular package, the temperature sensor measuring a reference temperature used as temperature of a predetermined portion of the MEMS chip; and a printed circuit board configured to calculate the internal temperature of the measurement object based on output of the sensor package. An outer bottom face of the sensor package projects from a plate face of the printed circuit board through a through-hole made in the printed circuit board.