MEMS Sensor Single Anchor Strain Distribution
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Solution Overview
Problem
Conventional MEMS sensors connected to multiple anchors experience non-uniform strain distribution, leading to unstable detection characteristics and increased complexity in manufacturing due to separate bonding portions and layers.
Innovation Solution
A MEMS device design featuring a single anchor for the sensor unit, with a device wafer and cap wafer bonded by an aluminum germanium eutectic layer, where the device wiring is directly connected to the bonding layer and electrically coupled to the cap wiring, simplifying the structure and improving strain distribution uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a sensor unit is connected to multiple anchors, then the structural support is enhanced, but the strain distribution becomes non-uniform leading to unstable detection characteristics
Solution Approach 1:
The patent extracts and removes the unnecessary anchor connections from the sensor unit. By reducing from multiple anchors to a single anchor configuration, the design eliminates the source of non-uniform strain distribution while maintaining adequate structural support through the simplified single-point attachment mechanism.
2Reliability
If separate bonding portions and layers are used for device wiring and cap wiring, then the electrical connection is ensured, but the manufacturing complexity increases
Solution Approach 1:
The patent merges the bonding functions for device wiring and cap wiring into a single integrated bonding layer. This consolidation eliminates the need for separate bonding portions and layers, reducing manufacturing steps and complexity while ensuring reliable electrical connections through the unified bonding structure.
Solution Approach 2:
The bonding layer is designed to serve multiple functions simultaneously: it provides mechanical bonding between the device wafer and cap wafer, ensures electrical connection for both device wiring and cap wiring, and simplifies the manufacturing process. This multi-functional approach reduces the number of separate components needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design stabilizes detection characteristics by uniformly distributing strain and simplifies the manufacturing process, reducing the risk of zero-point offset and enhancing precision in sensor unit formation.
Implementation Method 1
a bonding layer bonding the device wafer to the cap wafer
Data Source
AI summary
The present disclosure provides a MEMS device including a device wafer, a cap wafer and a bonding layer. The device wafer includes: a device substrate, having a first main surface, a second main surface opposite to the first main surface, and a cavity recessed along a first direction from the first main surface toward the second main surface; a sensor unit, located within the cavity and mechanically connected to and electrically insulated from the device substrate by a single anchor; and a device wiring, electrically coupled to the sensor unit. The cap wafer includes: a cap substrate, facing the device wafer from a side of the first main surface; and a cap wiring, electrically coupled to the device wiring. The bonding layer bonds the device wafer with the cap wafer, and the device wiring is directly connected to the bonding layer.