MEMS Shuttle Actuator Socket for Sample Characterization
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Solution Overview
Problem
Existing MEMS devices face challenges in loading thin samples without damaging their sensitive electro-mechanical components, particularly comb-drive-based strain sensors, during the characterization of physical properties.
Innovation Solution
A MEMS device with a socket for receiving a separate MEMS chip that can be loaded with the sample, where the force applied by a shuttle member is transferred to the chip, allowing for characterization without directly applying force to the sensitive components, and the MEMS chip can be designed to exclude sensitive elements or integrate them as separate components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If thin samples are loaded onto the sample receiving area of existing MEMS devices using firm pressing or liquid transfer techniques, then the sample can be deposited onto the device, but the sensitive electro-mechanical components such as comb-drive-based strain sensors are significantly damaged
Solution Approach 1:
The device is divided into two separate components: a robust MEMS chip for sample reception and a separate MEMS device with sensitive components. The MEMS chip can be easily loaded with samples using standard techniques, while the sensitive strain sensors remain isolated in the separate MEMS device, preventing damage during sample loading operations.
Solution Approach 2:
The MEMS chip acts as an intermediary between the sample and the sensitive MEMS device. The sample is first deposited onto the MEMS chip, which then interfaces with the MEMS device for characterization, thereby protecting the sensitive components from direct exposure to sample loading processes.
2Device complexity
If sensitive elements such as comb-drive-based strain sensors and shuttle movement actuators are integrated into the MEMS chip, then the device complexity is reduced, but the risk of damaging these components during sample loading increases
Solution Approach 1:
The sensitive elements (comb-drive-based strain sensors and shuttle movement actuators) are segregated from the MEMS chip and placed in a separate MEMS device. This segmentation allows the MEMS chip to maintain simple structure for sample reception while the sensitive components are protected in the separate device from sample loading damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes the risk of damaging the MEMS device's sensitive components during sample loading, enabling accurate characterization of physical properties while protecting the delicate components.
Implementation Method 1
the shuttle actuator configured for expanding the arms, said expanding applying a force onto the shuttle member and moving the shuttle member at least partly in the longitudinal orientation
Implementation Method 2
at least a force sensor mounted between the shuttle member and the framework and configured to generate a signal indicative of the force applied onto the shuttle member
Implementation Method 3
the force applied onto the shuttle member is transferred into stress internal to the MEMS chip via the tip of the shuttle member
Implementation Method 4
the movement of the shuttle member being affected by a resistance of the sample to the transferred stress
Data Source
AI summary
There is described a system for characterizing a physical property of a sample. The system generally has a microelectromechanical system (MEMS) device having a framework, a shuttle member extending along a longitudinal orientation within the framework, a shuttle actuator having obliquely extending arms extending between the framework and the shuttle member, the shuttle actuator configured for expanding the arms upon application of electricity thereacross, said expanding applying a force onto the shuttle member and moving the shuttle member at least partly in the longitudinal orientation, and a socket positioned adjacent a tip of the shuttle member; and a MEMS chip receiving the sample and being configured for insertion into the socket, whereby, when the MEMS chip is received in the socket and loaded with the sample, the force applied onto the shuttle member is transferred into stress internal to the MEMS chip via the tip of the shuttle member.