MEMS Side Surface Wire Bonding for Solder Bridging
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Solution Overview
Problem
The coupling of microelectromechanical systems (MEMS) components to circuit platforms often results in issues such as solder bridging and wicking due to their large surface area to volume ratio, which complicates the attachment process and narrows the die placement window.
Innovation Solution
The use of self-supporting and cantilevered wire bond wires attached to the side surfaces of MEMS components, which extend away from the first side surfaces with a greater surface area than the second side surfaces, providing a secure and stable connection to the circuit platform without the need for extensive soldering or bridging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper stud bumps are used with solder shooting to connect MEMS component to PCB, then electrical connection is achieved, but solder bridging between bond pads and die edge occurs
Solution Approach 1:
The patent extracts the harmful soldering process from the connection method. Instead of using solder shooting that causes bridging, the invention uses direct copper stud bump connections to PCB pads, eliminating the solder paste application step that creates unwanted solder bridges between bond pads and die edges.
Solution Approach 2:
The copper stud bumps serve as an intermediary connection element between the MEMS component and PCB. These stud bumps provide direct mechanical and electrical connection without requiring solder paste, acting as a mediator that avoids the bridging issue while maintaining reliable electrical connection.
2Object-affected harmful factors
If solder paste is applied by screen printing to prevent bridging, then solder bridging is reduced, but die placement window is narrowed
Solution Approach 1:
The invention removes solder paste application from the process entirely. By using direct copper stud bump connections without solder paste, the die placement window is widened since precise alignment is no longer critical for solder paste placement, while bridging is eliminated through the absence of excess solder material.
3Strength
If copper stud bumps are positioned close to PCB for connection, then connection strength is improved, but solder wicking to die edge increases
Solution Approach 1:
The invention converts the potential harm of close positioning by eliminating solder paste entirely. The copper stud bumps can be positioned close to the PCB for strong connection without causing wicking, because the connection is achieved through direct metal-to-metal contact rather than molten solder that would wick along the die edge.
Data Source
AI summary
An apparatus relates generally to a microelectromechanical system component. In such an apparatus, the microelectromechanical system component has a lower surface, an upper surface, first side surfaces, and second side surfaces. Surface area of the first side surfaces is greater than surface area of the second side surfaces. The microelectromechanical system component has a plurality of wire bond wires attached to and extending away from a first side surface of the first side surfaces. The wire bond wires are self-supporting and cantilevered with respect to the first side surface of the first side surfaces.