MEMS Actuator Surface Mounting via Solder Flexures
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Solution Overview
Problem
Microelectromechanical systems (MEMS) actuators face challenges in surface mounting due to interference from standard integrated circuit packages, which can prevent proper operation by interfering with external moving parts and applying stress, limiting their use in applications like miniature cameras.
Innovation Solution
The development of silicon MEMS devices with solder contacts and flexures that allow for surface mounting on printed circuit boards, enabling electrical connection while mitigating stress through flexible contact points, allowing for various orientations and reduced interference with external moving parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a MEMS actuator is packaged in a standard integrated circuit package, then electrical connection is facilitated, but the package interferes with external moving parts and applies stress to the actuator
Solution Approach 1:
The patent removes the traditional integrated circuit package entirely, exposing the MEMS actuator for direct surface mounting on the circuit board. This extraction eliminates the harmful interference and stress caused by packaging while maintaining electrical connection capabilities through direct contact pads on the actuator structure itself
Solution Approach 2:
The actuator structure is designed to perform multiple functions: it provides both the mechanical actuation function and the electrical connection function through integrated contact pads. This multi-functionality eliminates the need for separate packaging while maintaining electrical connectivity
2Object-affected harmful factors
If a MEMS actuator is mounted directly to a circuit board, then interference with moving parts is reduced, but stress is applied to the actuator during soldering and operation
Solution Approach 1:
The patent introduces flexible flexures as thin film structures that connect the actuator to the circuit board. These flexures are designed to be mechanically compliant, allowing them to absorb thermal expansion stress and mechanical stress during soldering and operation while maintaining electrical connection through integrated contacts
3Stress or pressure
If flexures are used to mitigate stress, then stress on the actuator is reduced, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into the flexure structure: it serves as both a mechanical stress-absorbing element and an electrical connection carrier. The flexure integrates both structural and electrical roles, reducing the need for separate components and thereby limiting the increase in overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables reliable surface mounting of MEMS actuators on circuit boards, facilitating their use in diverse applications by reducing stress and interference, thus enhancing their operational efficiency and versatility.
Implementation Method 1
The silicon MEMS device can be configured to be electrically connected to the circuit board via the solder contact(s)
Implementation Method 2
The flexures can mitigate stress applied to the MEMS actuator
Data Source
AI summary
A silicon MEMS device can have at least one solder contact formed thereupon. The silicon MEMS device can be configured to be mounted to a circuit board via the solder contact(s). The silicon MEMS device can be configured to be electrically connected to the circuit board via the solder contact(s).