MEMS Interspace Formation Using Spacer Layers
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Solution Overview
Problem
The manufacturing process of micro electro mechanical systems (MEMS) is complex and time-consuming, with poor yield due to the need for a sacrifice layer etching process, which restricts the etching time and requires expensive equipment.
Innovation Solution
The use of spacer layers with adhesive properties to form interspaces between substrates and functional layers, eliminating the need for sacrifice layer etching and allowing for the formation of micro electro mechanical systems and semiconductor devices with improved yield and reduced processing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a sacrifice layer etching process is used to form interspaces in MEMS, then the interspace structure can be created, but the manufacturing process becomes complex and time-consuming with poor yield
Solution Approach 1:
The patent extracts and removes the problematic sacrifice layer etching process from the manufacturing flow. Instead of forming interspaces through complex lateral etching of sacrifice layers, the invention uses spacer layers that are selectively removed to create interspaces, eliminating the need for time-consuming etching processes while maintaining precise interspace formation.
Solution Approach 2:
The patent inverts the conventional approach by instead of etching away sacrifice layers to form interspaces, it builds up spacer layers and selectively removes portions to create the same interspace structure. This inversion transforms a subtractive etching process into a more controlled removal process that improves yield and reduces manufacturing time.
2Loss of time
If a two-layer sacrifice layer structure with tunnel structure is used, then etching time is reduced, but the manufacturing process becomes more complex and yield improvement is difficult
Solution Approach 1:
The patent employs disposable spacer layers that serve their purpose during manufacturing and are then removed. These spacer layers are simple, temporary structures that enable interspace formation without requiring complex multi-layer sacrifice structures with tunnel openings, thereby reducing both time and complexity.
3Manufacturing precision
If traditional etching processes are used for sacrifice layer removal, then interspaces can be formed, but expensive etching apparatus are required
Solution Approach 1:
The patent replaces the mechanical/chemical etching system with a simpler removal process. Instead of using expensive etching apparatus to laterally etch through sacrifice layers, the invention uses spacer layer removal techniques that can be accomplished with less complex equipment, reducing manufacturing costs while maintaining precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, eliminates the need for expensive etching apparatus, and enhances the yield of micro electro mechanical systems by forming interspaces using spacer layers, thereby reducing processing time and improving the efficiency of MEMS production.
Implementation Method 1
a spacer layer having adhesiveness which is formed selectively between a substrate and a functional layer
Data Source
AI summary
The present invention provides a MEMS and a sensor having the MEMS which can be formed without a process of etching a sacrifice layer. The MEMS and the sensor having the MEMS are formed by forming an interspace using a spacer layer. In the MEMS in which an interspace is formed using a spacer layer, a process for forming a sacrifice layer and an etching process of the sacrifice layer are not required. As a result, there is no restriction on the etching time, and thus the yield can be improved.