MEMS Speaker Cavity Synchronous Membrane Actuation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Micro sound producing devices, such as MEMS microspeakers, require protection due to their small size and fragile structure, necessitating a package structure that enhances yield rate and reliability while potentially reducing size and improving sound pressure levels.
Innovation Solution
A sound producing package structure comprising multiple chips with membranes and actuators disposed within a cavity, where the membranes are actuated synchronously to produce sound pressure, and a manufacturing method involving the formation of chips and wall structures to create a chamber with chips positioned between them, enhancing protection and sound production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a package structure is provided to protect micro sound producing devices, then reliability is improved, but device complexity increases
Solution Approach 1:
The package structure is divided into multiple cavities, with each cavity containing a separate chip with sound producing membrane and actuator. This segmentation allows independent protection and operation of each sound producing element, improving reliability while maintaining manageable complexity through modular design
Solution Approach 2:
Multiple chips are integrated within a single package structure that shares common wall structures and cavity spaces. The chips are combined in a way that they collectively enhance sound pressure level while being protected by the unified package, improving reliability without proportionally increasing complexity
2Power
If multiple chips are used to produce acoustic waves, then sound pressure level is improved, but device complexity increases
Solution Approach 1:
Multiple chips are merged within a single package structure, sharing common wall structures and cavity spaces. This merging approach allows the collective sound pressure level to be enhanced while avoiding the complexity of completely separate devices, as the chips operate together in an integrated manner
Solution Approach 2:
The multiple chips are arranged in a three-dimensional configuration within the package cavity, utilizing spatial dimensionality to accommodate multiple sound producing elements. This dimensional arrangement allows enhanced sound pressure through multiple sources while managing complexity through efficient spatial utilization
3Volume of moving object
If micro sound producing devices are made smaller, then device size is reduced, but reliability deteriorates due to fragile structure
Solution Approach 1:
The package structure is segmented into multiple cavities, each protecting an individual chip. This segmentation provides dedicated protection spaces for each fragile micro component, allowing small device size while improving reliability through isolated protection of each element from mechanical stress and environmental damage
Solution Approach 2:
The fragile micro chips are nested within the protective package structure, with each chip positioned within its own cavity formed by wall structures. This nesting arrangement protects the fragile small components while maintaining compact overall device size, as the protection structure is integrated rather than additive
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the yield rate and reliability of the sound producing package, reduces its size, and in some cases, increases the sound pressure level by utilizing multiple chips to produce acoustic waves.
Implementation Method 1
a MEMS microspeaker may use a thin film piezoelectric material as actuator
Data Source
AI summary
A sound producing package structure includes a plurality of chips disposed within a cavity. The chips includes a first chip and a second chip, the first chip includes a first sound producing membrane and a first actuator attached to the first sound producing membrane, and a second chip includes a second sound producing membrane and a second actuator attached to the second sound producing membrane. The first sound producing membrane and the second sound producing membrane are actuated toward a center of the cavity in a synchronous fashion so as to produce a sound pressure.