MEMS Speaker Damping Mesh Reduces Resonance Distortion

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Solution Overview

Problem

MEMS speakers experience increased total harmonic distortion due to vibration, affecting their performance, which existing designs have not adequately addressed.

Innovation Solution

Incorporating a damping mesh with an acoustic impedance value of 1 Mrayl-500 Mrayl, attached to the housing or printed circuit board, to cover the sound hole and reduce resonance distortion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If a MEMS speaker chip vibrates to emit sound, then sound output is achieved, but total harmonic distortion increases

Engineering Contradiction:
Improvesound outputVSAvoidtotal harmonic distortion
Core Design Contradiction:
Illumination intensityVSManufacturing precision

Solution Approach 1:

A damping mesh is introduced as an intermediary component between the sound hole and the external environment. The mesh has specific acoustic impedance characteristics (1 Mrayl-500 Mrayl) that allow it to interact with sound waves emerging from the MEMS speaker chip, damping resonance peaks and reducing total harmonic distortion while maintaining sound output capability

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The acoustic impedance of the damping mesh is carefully selected within a specific range (1 Mrayl-500 Mrayl) to optimize its damping effect. By controlling the acoustic impedance parameter, the mesh effectively reduces resonance peaks and total harmonic distortion across different frequency ranges, improving overall sound quality

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If a damping mesh is added to reduce distortion, then total harmonic distortion decreases, but device complexity increases

Engineering Contradiction:
Improvetotal harmonic distortionVSAvoidstructure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The damping mesh is implemented as a thin, flexible membrane structure that can be easily integrated into the existing speaker housing. This thin-film approach adds minimal structural complexity while effectively achieving the desired acoustic damping performance

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The damping mesh utilizes a porous material structure that provides acoustic damping functionality through its inherent physical properties. The porous structure naturally interacts with sound waves to reduce resonance peaks without requiring complex mechanical or electronic components

Inventive Principle:
Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The damping mesh effectively adjusts the quality factor of the MEMS speaker, reducing resonance peaks and improving sound pressure level and total harmonic distortion, thereby enhancing the speaker's performance.

Implementation Method 1

a damping mesh connected to the housing and covering the sound hole; wherein sounds emitted by the MEMS speaker chip transmit outward through the sound hole and the damping mesh

Methodology Applied
Scientific EffectResonance damping: Damping

Data Source

PatentUS11910155B2MEMS speaker
Publication Date: 2024.02.20 AAC KAITAI TECHNOLOGIES (WUHAN) CO LTD
  • US11910155B2 patent drawing
  • US11910155B2 patent drawing
  • US11910155B2 patent drawing

AI summary

The present disclosure discloses a MEMS speaker including a housing with a receiving space; a MEMS speaker chip with an inner cavity, accommodated in the receiving space and connected with the housing, the MEMS speaker chip dividing the receiving space into a first cavity and a second cavity communicating with the inner cavity; a sound hole communicating with the first cavity or the second cavity; and a damping mesh connected to the housing and covering the sound hole; wherein sounds emitted by the MEMS speaker chip transmit outward through the sound hole and the damping mesh. Compared with the related art, MEMS speaker disclosed by the present disclosure has a better reliability.