MEMS Multi-Module Assembly Stacked Die Integration
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Solution Overview
Problem
Existing MEMS device packages are large due to separate encapsulation of multiple MEMS devices in different dies, which limits miniaturization and efficiency in electronics apparatus.
Innovation Solution
A MEMS multi-module assembly is created by stacking multiple dies with MEMS devices, where each die is bonded through thermal-compression or adhesive bonds and interconnected via through silicon vias, allowing multiple devices to share holes for external connection, reducing package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple MEMS devices are provided in different dies with separate encapsulation, then each device can be independently manufactured and tested, but the overall package size becomes large
Solution Approach 1:
Multiple dies containing MEMS devices are stacked and bonded together to form a single integrated package. The dies are vertically arranged and connected through through-silicon vias, merging multiple separate devices into one compact three-dimensional structure that reduces overall package volume while maintaining individual device functionality
Solution Approach 2:
The patent transitions from a two-dimensional planar arrangement of separate dies to a three-dimensional stacked configuration. By stacking dies vertically and connecting them through the z-axis using through-silicon vias, the design utilizes the third dimension to reduce the footprint and overall package size while preserving device independence
2Volume of stationary object
If multiple dies are stacked and bonded together, then package size is reduced, but manufacturing complexity increases
Solution Approach 1:
Through-silicon vias are formed and conductive materials are deposited in the dies before the stacking and bonding process. This preliminary preparation of interconnection structures eliminates the need for complex post-bonding alignment and connection steps, simplifying the overall manufacturing process while enabling three-dimensional stacking
3Device complexity
If dies are stacked with through-silicon via connections, then vertical electrical interconnection is achieved, but manufacturing precision requirements increase
Solution Approach 1:
Through-silicon vias are pre-formed with precise positioning and conductive materials are deposited before stacking. This advance preparation ensures accurate vertical alignment when dies are bonded together, reducing the precision requirements during the actual stacking process while achieving reliable electrical interconnection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the package size of MEMS devices while maintaining external connectivity, enabling more compact and efficient integration in electronics apparatus.
Implementation Method 1
the first die and the second die are bonded through at least one of metal-metal thermal-compression bond
Implementation Method 2
the first die and the second die are vertically electrically interconnected by through silicon via
Data Source
AI summary
A MEMS multi-module assembly, manufacturing method, and electronics apparatus are disclosed herein. The MEMS multi-module assembly comprises: a first die having a first hole; and a second die stacked on the first die, having a second MEMS device, wherein the second MEMS device is connected outside via the first hole.