MEMS Substrate Plate Extra Contact Pad Footprint Design
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Solution Overview
Problem
Existing substrate plates for MEMS devices have limitations in the area available for contact pads during testing and manufacturing, leading to high electrical resistance and potential damage to regular contact pads before permanent bonding, due to the location of extra contact pads in the scribe line and limited area for contacting MEMS devices.
Innovation Solution
A substrate plate design where at least a major part of the extra contact pad is formed within the footprint of the MEMS device, allowing for reliable contact and testing without increasing the total substrate area, and ensuring the regular contact pads are not used until permanent bonding, enabling efficient application of voltage and test signals to multiple devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the extra contact pad is located in the scribe line, then the substrate area is not increased, but the contact area is limited and electrical resistance becomes too high
Solution Approach 1:
The extra contact pad is moved from the scribe line area to the footprint area of the MEMS device, effectively utilizing the two-dimensional space more efficiently. This repositioning allows the contact pad to be formed within the device footprint while still providing sufficient contact area, thereby increasing electrical contact reliability without requiring additional substrate area.
2Area of stationary object
If the extra contact pad is located in the scribe line, then the substrate area is not increased, but the contact area is limited leading to high electrical resistance
Solution Approach 1:
The extra contact pad is repositioned from the scribe line to the footprint area, utilizing the available space within the device boundaries. This allows for larger contact pads that reduce electrical resistance and improve manufacturing reliability, while the lead structure extending outside the footprint ensures proper electrical connections are maintained.
3Ease of operation
If regular contact pads are used for testing, then contact area is available, but the contact pads may be damaged before permanent bonding
Solution Approach 1:
An extra contact pad is introduced as an intermediary element for testing and manufacturing operations. This additional contact pad serves as a temporary connection point that can be used during testing and polarization processes without risking damage to the regular contact pads that will be used for permanent bonding. The lead structure connects this extra contact pad to the regular contact pads, enabling safe intermediary connections.
Data Source
AI summary
A substrate plate is provided for at least one MEMS device to be mounted thereon. The MEMS device has a certain footprint on the substrate plate, and the substrate plate has a pattern of electrically conductive leads to be connected to electric components of the MEMS device. The pattern forms contact pads within the footprint of the MEMS device and includes at least one lead structure that extends on the substrate plate outside of the footprint of the MEMS device and connects a number of the contact pads to an extra contact pad. The lead structure is a shunt bar that interconnects a plurality of contact pads of the MEMS device and is arranged to be removed by means of a dicing cut separating the substrate plate into a plurality of chip-sized units. At least a major part of the extra contact pad is formed within the footprint of one of the MEMS devices.