MEMS Package Substrate Metal Support Zones
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Solution Overview
Problem
Semiconductor package substrates face challenges in withstanding mechanical and thermal stresses during the assembly process, particularly the molding step, leading to issues like delamination and tilting of the die, which affect the durability and performance of MEMS devices.
Innovation Solution
A semiconductor package substrate design featuring a core with metal support zones beneath the damage-sensitive device, occupying a substantial area free of routing lines, and a method for producing such substrates by depositing metal layers with support zones and solder mask layers to enhance mechanical stability and balance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal layers are deposited to provide electrical connections and routing, then electrical functionality is achieved, but mechanical stability and balance deteriorate due to stress during molding
Solution Approach 1:
The metal layers are segmented into functional routing areas and support zones. The support zones are strategically positioned beneath the device to provide mechanical stability, while routing areas provide electrical connections. This segmentation allows each region to serve its primary function without compromising the other.
Solution Approach 2:
Different regions of the metal layers are given different qualities: routing areas are optimized for electrical conductivity and signal transmission, while support zones are optimized for mechanical strength and stress distribution. This local differentiation resolves the contradiction between electrical functionality and mechanical stability.
2Ease of manufacture
If the substrate structure is simplified for ease of manufacture, then manufacturing cost decreases, but the ability to withstand molding stress deteriorates
Solution Approach 1:
Metal support zones are deposited during the substrate manufacturing process, before the molding step. This preliminary action ensures that the structural reinforcement is already in place to withstand the subsequent molding stress, preventing delamination and warpage without requiring complex post-processing.
3Stability of the object's composition
If metal support zones are added beneath the device, then mechanical stability improves, but device complexity increases
Solution Approach 1:
The metal support zones are merged with the existing metal routing layers during the deposition process. This integration allows the support function to be added without creating separate complex structures, as the support zones and routing layers are formed in the same manufacturing step using standard photolithography and deposition techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate is more balanced and stable, reducing the risk of delamination, warpage, and tilting, thereby ensuring better durability and performance of the device during assembly and long-term use.
Implementation Method 1
at least one pair of metal layers (13a, 13b) are deposited on the upper and lower surfaces (14a, 14b) of the substrate core (14)
Implementation Method 2
one pair of solder mask layers (11a, 11b) are deposited on the outermost layers of the at least one pair of metal layers (13a, 13b)
Data Source
AI summary
A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described.