MEMS Component Support Using Flexible Carrier Foil
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Solution Overview
Problem
Existing packaging concepts for MEMS components face challenges such as mechanical stresses due to thermal expansion coefficient differences and increased production costs from larger footprints, which affect performance reliability and cost-effectiveness.
Innovation Solution
A composite component support made of a three-dimensionally shaped, flexible carrier foil and encasing material, where the carrier foil is molded onto the inner wall of the support, providing a mechanically rigid and electrically contactable structure that reduces thermal stresses and allows for cost-effective, space-saving packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a planar component support is used for mounting MEMS components, then the components can be electrically contacted and housed, but mechanical stresses occur due to different thermal expansion coefficients affecting performance reliability
Solution Approach 1:
The patent changes the physical parameters of the component support by making it three-dimensionally shaped and flexible, allowing it to adapt its shape to match the MEMS component contours. This parameter change enables the support to accommodate thermal expansion differences without generating harmful mechanical stresses, thereby maintaining performance reliability.
Solution Approach 2:
The invention uses a composite structure where a flexible carrier foil is combined with encasing material. The carrier foil provides flexibility and thermal adaptation, while the encasing material provides structural support. This composite approach allows the support to resist thermal stresses while maintaining mechanical stability.
2Adaptability or versatility
If components are mounted side-by-side on a planar component support, then all components can be housed, but the footprint of the assembly increases leading to higher production costs
Solution Approach 1:
The patent transitions from two-dimensional planar mounting to three-dimensional mounting by shaping the component support vertically. This allows components to be arranged in overlapping or stacked configurations, utilizing the third dimension (height) to reduce the horizontal footprint of the assembly while maintaining the ability to house multiple components.
Solution Approach 2:
The invention enables nested arrangement of components where smaller components can be positioned within the vertical profile of larger components. The three-dimensionally shaped support allows components to be nested or overlapped in the vertical direction, reducing the overall assembly footprint while accommodating all necessary components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces mechanical and thermomechanical stresses and minimizes production costs by adapting the thermal properties of the component support to match MEMS components, enabling reliable and efficient packaging of sensitive MEMS structures.
Implementation Method 1
an encasing material, which is molded onto the carrier foil on one side
Implementation Method 2
mechanical stresses often occur in the sensitive structure of the MEMS component, which are dependent on mounting and may be attributed to different thermal expansion coefficients
Data Source
AI summary
A component support allows cost-effective, space-saving and low-stress packaging of MEMS components having a sensitive structure. The component support is suited, in particular, for MEMS components, which are mounted in the cavity of a housing and are intended to be electrically contacted. The component support is produced as a composite part in the form of a hollow body open on one side, the composite part being made essentially of a three-dimensionally shaped carrier foil flexible in its shaping, and an encasing material. The encasing material is molded onto one side of the carrier foil, so that the carrier foil is situated on the inner wall of the component support. At least one mounting surface for at least one component is formed on the inner wall having the carrier foil. The carrier foil is also provided with contact surfaces and insulated conductive paths for electrically contacting the at least one component.